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Composite water-based conductive adhesive based on carbon material/heteropoly acid/amino acid and preparation method of composite water-based conductive adhesive

A technology of heteropoly acid and carbon materials, applied in the field of materials, can solve the problems of long-range conjugated structure damage, high cost, and tediousness of carbon materials, and achieve good electrical conductivity, cycle stability, good bonding strength, and stable bonding good sex effect

Active Publication Date: 2019-03-08
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the preparation process of most of the current carbon-containing water-based conductive adhesives is complex and cumbersome [B.Amoli, J.Trinidad, G.Rivers, S.Sy, P.Russo, A.Yu, N.Y.Zhou, B.Zhao, Carbon ,2015,91,188], leading to high cost of final materials, and many problems in large-scale preparation
For example, the existing preparation process needs to chemically modify the surface of the carbon material first. This destructive surface modification method can easily cause the destruction of the long-range conjugated structure of the carbon material, although it can be partially restored by using a reducing agent in the subsequent preparation process. its conjugated structure, but the electrical conductivity of the carbon material is significantly affected, and these methods require tedious chemical treatments
In addition, the viscous raw materials used in most current methods are mainly synthetic polymers, and these polymer materials need to be synthesized in organic solvents through multi-step synthesis, which inevitably aggravates environmental pollution[Q.Zhang, L. Liu, C. Pan, D. Li, G. Gai, J. Mater. Chem. C, 2018, 6, 1746]

Method used

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  • Composite water-based conductive adhesive based on carbon material/heteropoly acid/amino acid and preparation method of composite water-based conductive adhesive
  • Composite water-based conductive adhesive based on carbon material/heteropoly acid/amino acid and preparation method of composite water-based conductive adhesive
  • Composite water-based conductive adhesive based on carbon material/heteropoly acid/amino acid and preparation method of composite water-based conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] 1. Graphene / H 6 P 2 W 18 o 62 Preparation of / L-tryptophan composite water-based conductive adhesive

[0029] 39.24mg graphene (reduced form) and 1069.78mg H 6 P 2 W 18 o 62 (Molecular weight is 4369.07g / mol) place together in agate mortar and grind 10min, then put 200mg L-tryptophan into the above containing reduced graphene and H 6 P 2 W 18 o 62 Continue grinding for 10 min in a mortar. The final ground powder was placed in a glass sample bottle filled with 2 mL of double distilled water and the pH of the solution was controlled with hydrochloric acid = 2, then the solution was heated to 55 °C and ultrasonicated for 3 min to make the three raw materials synergistically assembled in the aqueous solution. When the aqueous solution in the sample bottle is cooled to room temperature 25°C, the graphene / H 6 P 2 W 18 o 62 / L-tryptophan composite water-based conductive adhesive.

[0030] The supernatant was removed, and the composite water-based conductive adh...

Embodiment 2

[0053] As shown in Example 1, other conditions remain unchanged, 200mg L-tryptophan (molecular weight is 204.23g / mol) is changed into 242mg L-phenylalanine (molecular weight is 165.19g / mol), and graphene The mass of (reduced form) was changed from 39.24 mg to 39.37 mg, and hydrochloric acid was used to control the pH=1 of the final aqueous solution to prepare a composite water-based conductive adhesive. The resulting "graphene / H 6 P 2 W 18 o 62 / L-Phenylalanine" conductive adhesive has tensile and shear strengths of 14.31±2.10kPa, 7.83±2.50kPa, 5.99±1.20 for stainless steel, glass, polyetheretherketone, polycarbonate and polypropylene under water. kPa, 5.53±1.20kPa, 5.60±1.30kPa; the tensile shear strength of stainless steel, glass, polyether ether ketone, polycarbonate and polypropylene in dry state is 506.00±25.00kPa, 305.20±35.00kPa respectively , 268.53±35.00kPa, 183.25±26.00kPa, 136.28±15.00kPa. This shows that the composite water-based conductive adhesive has good ad...

Embodiment 3

[0055] As shown in Example 1, other conditions remain unchanged, 200mg L-tryptophan (molecular weight is 204.23g / mol) is changed into 228mg L-histidine (molecular weight is 155.16g / mol), and graphene ( The mass of reduced form) was changed from 39.24mg to 38.93mg, and hydrochloric acid was used to control the pH=3 of the final aqueous solution to prepare composite water-based conductive adhesive. The resulting "graphene / H 6 P 2 W 18 o 62 / L-histidine" conductive adhesive under water has tensile and shear strengths of 18.32±1.30kPa, 7.53±1.36kPa, 6.13±1.40kPa for stainless steel, glass, polyetheretherketone, polycarbonate and polypropylene respectively , 5.56±1.20kPa, 5.84±1.6kPa; the tensile shear strength of stainless steel, glass, polyether ether ketone, polycarbonate and polypropylene in dry state is 632.02±50.00kPa, 452.32±36.00kPa, 189.53±32.00kPa, 176.96±26.30kPa, 106.82±20.00kPa. This shows that the composite water-based conductive adhesive has good adhesion to most...

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Abstract

The invention relates to a composite water-based conductive adhesive based on carbon material / heteropoly acid / amino acid and a preparation method of the composite water-based conductive adhesive, andbelongs to the technical field of materials science. The preparation method comprises the following steps: firstly, sufficiently grinding a mixture of carbon materials and heteropoly acid according toa solid grinding method; then, adding natural amino acid into the ground powder and continuing to grind, so that the amino acid is respectively connected with the heteropoly acid and the carbon material through non-covalent interaction; finally, synergistically assembling the three components according to a method of combining aqueous phase heating with ultrasonic treatment to obtain the composite water-based conductive adhesive based on carbon material / heteropoly acid / amino acid, wherein the composite water-based conductive adhesive, based on 100% by weight, comprises 1%-6% of carbon material, 62%-79% of heteropoly acid, 13%-20% of amino acid, and 6%-9% of trace hydrochloric acid or sodium hydroxide and water. The composite water-based conductive adhesive based on carbon material / heteropoly acid / amino acid provided by the invention is simple in preparation process, mild in condition, free of surface treatment on the carbon material, and simple and effective in synthesis method; the obtained conductive adhesive shows good adhesion and electrical conductivity in a water environment or air.

Description

technical field [0001] The invention belongs to the field of material technology, and in particular relates to a composite water-based conductive adhesive based on carbon material / heteropolyacid / amino acid and a preparation method thereof. The conductive adhesive can effectively bond various solid surfaces, and can be used as a rigid or flexible conductive material. After being forcibly damaged by an external force, it can quickly restore its shape and conductivity in the presence of a very small amount of water. Background technique [0002] As a substitute for tin-lead solder, conductive adhesive has the advantages of flexible operation, light weight, mild processing conditions, and wide application range, and has become an indispensable functional material in the processing of microelectronic devices and integrated circuit construction [H. Cui, Q.Fana, D.-S.Lia, Polym Int 2013, 62, 1644]. In recent years, the rapid development of flexible, stretchable, wearable and impla...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J11/06
CPCC09J9/02C09J11/06
Inventor 李文杜章磊李豹吴立新
Owner JILIN UNIV