A copper-coated glass fiber base asphalt root puncture resistant waterproof membrane
A glass fiber and root puncture-resistant technology, which is applied in fiber processing, textiles and papermaking, etc., can solve the problems of difficult processing of inner corners, poor root resistance performance of coiled materials, and increased costs, and achieve root puncture resistance and waterproof effects Good, high tensile and tear strength, cost-effective production
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0028] 1) Electroless copper plating on glass fiber cloth:
[0029] ① Arrange the glass fibers in a degreasing liquid for 30 minutes at 40°C, and place the treated glass fibers in 10wt% dilute sulfuric acid to neutralize the lye on the surface;
[0030] The formula of the degreasing liquid is: sodium hydroxide 60g / L; sodium carbonate 30g / L; sodium phosphate 15g / L mixed solution;
[0031] ② Arrange the degreased and neutralized glass fiber in step ① in the sensitization solution, sensitize it at 25°C for 10 minutes, and rinse it repeatedly with clean water;
[0032] The sensitizing solution is: a mixture of stannous chloride 10g / L and hydrochloric acid 40ml / L; the percentage concentration of hydrochloric acid is 38%;
[0033] ③Arrange the glass fiber sensitized by step ② in the activation solution and activate it at 25°C for 10 minutes, and the Pd in the solution 2+ The ions are converted into metal Pd particles, and then placed in 10g / L sodium hypophosphite for 10min to re...
Embodiment 2
[0041] Embodiment 2, with embodiment 1, the difference is,
[0042] 1) Electroless copper plating on glass fiber cloth:
[0043] ④Use ammonia water to adjust the pH value of the plating solution to 10, place the activated glass fiber in step ③ in the copper plating solution, plate copper at 80°C for 20 minutes, and dry to obtain a copper-plated glass fiber cloth;
[0044] Described copper plating liquid is: copper sulfate 40g / L, sodium hypophosphite 30g / L, sodium citrate 60g / L, the mixed solution of ammonium chloride 50g / L and thiourea 5mg / L;
Embodiment 3
[0045] Embodiment 3, with embodiment 1, the difference is,
[0046] 1) Electroless copper plating on glass fiber cloth:
[0047] ④Use ammonia water to adjust the pH value of the plating solution to 11, place the activated glass fibers in step ③ in the copper plating solution, and plate copper at 90°C for 30 minutes, and dry to obtain a copper-plated glass fiber cloth;
[0048] Described copper plating liquid is: copper sulfate 50g / L, sodium hypophosphite 40g / L, sodium citrate 70g / L, the mixed solution of ammonium chloride 60g / L and thiourea 6mg / L;
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 
