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Heat insulation material

A technology of thermal insulation material and fiber layer, which can be used in heat exchange equipment, pipelines through thermal insulation protection, synthetic resin layered products, etc., and can solve problems such as poor contact.

Active Publication Date: 2019-03-12
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, it is crushed into a large amount of fine powder of silica particles, which scatter into the electronic equipment, causing poor conditions such as poor contact

Method used

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  • Heat insulation material
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Experimental program
Comparison scheme
Effect test

no. 1 approach

[0043] use Figure 1A , Figure 1B , Figure 2A , Figure 2B ,as well as Figure 2C , the first embodiment of the present invention will be described.

[0044] Figure 1A It is a side cross-sectional view of the heat insulating material 101 of the first embodiment. Such as Figure 1A As shown, one side of the heat insulating material 101 carrying the silica airgel fibers 102 is covered with a support layer 103a, and the back surface of the silica airgel-carrying fibers 102 is covered with a support layer 103b.

[0045] The silica airgel-carrying fiber 102 (an example of a fiber layer) is a nonwoven fabric carrying silica airgel. The silica airgel is supported on the entire surface of the silica airgel-supported fiber 102 and is carried in the entire thickness direction.

[0046] Figure 1B It is an enlarged view of the welded portion of the heat insulating material according to the first embodiment. Such as Figure 1B As shown, between the support layer 103a and the...

no. 2 approach

[0070] use Figure 3A , Figure 3B , Figure 3C ,as well as Figure 3D A second embodiment of the present invention will be described. It should be noted that, in the following description of the second embodiment, configurations different from the first embodiment will be mainly described. In addition, in FIG. 3, the same code|symbol is used for the same component as 1st Embodiment, and description is abbreviate|omitted.

[0071] Figure 3A It is a perspective view of the heat insulating material 101 of this 2nd Embodiment. Such as Figure 3A As shown, the support layer 301 encloses the fiber 102 loaded with silica airgel. From Figure 3A The surface of the heat insulating material 101 viewed in the direction of the arrow A shown is an example of the exposed surface where the silica airgel-carrying fibers 102 and the silica airgel are exposed.

[0072] Figure 3B is viewed from the direction of arrow A Figure 3A The diagram obtained from the insulation material 10...

no. 3 approach

[0086] use Figure 4A , Figure 4B , Figure 4C ,as well as Figure 4D A second embodiment of the present invention will be described. It should be noted that, in the following description of the third embodiment, configurations different from those of the second embodiment will be mainly described. In addition, in FIG. 4, the same code|symbol is used for the same component as 2nd Embodiment, and description is abbreviate|omitted.

[0087] Figure 4A It is a perspective view of the heat insulating material 101 of this 3rd Embodiment. Such as Figure 4A As shown, the support layer 401 encloses the fiber 102 loaded with silica airgel. From Figure 4A The surface of the heat insulating material 101 viewed in the direction of the indicated arrow C is an example of the exposed surface where the silica airgel-carrying fibers 102 and the silica airgel are exposed.

[0088] Figure 4B is viewed from the direction of arrow C Figure 4A The diagram obtained from the insulatio...

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Abstract

A heat insulation material is disclosed which simplifies processes of measures for preventing contamination of a surrounding caused by falling off of a silica aerogel in a silica-aerogel support heatinsulator. In the silica-aerogel support heat insulator, a support layer whose melting point is lower than a melting point of a fiber supporting the silica aerogel is used, and by performing thermal-pressure bonding at a temperature lower than the melting point of the fiber but higher than the melting point of the support layer to cause the support layer to enter the fiber to combine the support layer and the fiber. Thus, processes of measures for preventing contamination of a surrounding caused by falling off of the silica aerogel can be simplified, and use in a large size and / or in a complicated shape is made possible.

Description

technical field [0001] The present invention relates to a heat insulating material. Background technique [0002] In recent years, as the performance of electronic equipment and precision equipment such as smartphones, tablet PCs, and notebook PCs has increased, the heat generation density from heat-generating components has increased rapidly, and thermal diffusion technology for these electronic equipment has become an essential technology. [0003] In particular, small mobile devices have many chances of directly contacting the human body, and the temperature rise of the outer surface of the case becomes a serious problem. As one of the problems caused by the temperature rise of the outer surface of the casing of the mobile device, low-temperature burns can be cited. Low-temperature burns are a type of burns caused by prolonged exposure of the human body to temperatures higher than body temperature. For example, it has been reported that burns will occur in 6 hours at 44...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16L59/00B32B27/32B32B27/06B32B27/02B32B27/36B32B9/00B32B9/04B32B7/10
CPCB32B5/02B32B7/10B32B27/06B32B27/32F16L59/00B32B2307/304B32B2262/0276F16L59/026F16L59/06F16L59/028F16L59/07F16L59/029
Inventor 濑川彰继梅田昌之
Owner PANASONIC CORP