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Photocured molding method for SiC ceramics

A technology of photocuring molding and silicon carbide ceramics, applied in the direction of additive processing, can solve the problems of high production cost, cutting molds, low precision, etc., and achieve the effect of eliminating development steps, fast molding speed, and high dimensional accuracy.

Pending Publication Date: 2019-03-15
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional method of preparing silicon carbide has the following disadvantages: low precision, difficulty in preparing parts with complex shapes, and the need for molds and corresponding processing tools, resulting in high preparation costs
Inadequacies of traditional methods of forming SiC ceramics limit their use

Method used

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  • Photocured molding method for SiC ceramics
  • Photocured molding method for SiC ceramics
  • Photocured molding method for SiC ceramics

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A kind of silicon carbide ceramic photocuring molding method of the present invention, process flow chart is as follows figure 1 As shown, the specific molding steps are as follows:

[0023] 1) First, prepare 30ml of slurry, mix 28.9g of SiC ceramic powder, photosensitive resin (HDDA, 21.2g), photoinitiator (TPO, 0.58g) into the ball mill jar, and rotate at 400r / min on the planetary ball mill Under ball milling for 2h, then add dispersant (17000, 0.29g) and ball mill for 2h. Finally, a uniformly dispersed SiC slurry is obtained. The slurry viscosity is lower than 3pa.s.

[0024] 2) The SiC slurry obtained in step 1) is printed into a SiC ceramic green body using a light-curing molding device, and the SEM image is as follows figure 2 shown;

[0025] 3) Put the silicon carbide ceramic green body obtained by photocuring into a graphite crucible, and put it into a vacuum sintering furnace for pyrolytic carbonization. Heating rate: room temperature to 200°C: 3°C / min; 2...

Embodiment 2

[0029] Except for the following steps, other preparation steps are the same as in Example 1: In step 1, SiC ceramic powder (33.7g), photosensitive resin (HDDA, 19.7g), and photoinitiator (TPO, 0.39g) are mixed and added to the ball mill jar In the planetary ball mill, rotate at 400r / min, ball mill for 2h, then add dispersant (17000, 0.34g), and continue ball milling for 2h. Finally, a uniformly dispersed SiC slurry is obtained. The viscosity is lower than 3pa.s. Compared with Example 1, the relative density and bending strength of the obtained SiC parts are improved.

Embodiment 3

[0031] Except for the following steps, other preparation steps are the same as in Example 1: In step 1, SiC ceramic powder (38.4g), photosensitive resin (HDDA, 18.2g), and photoinitiator (TPO, 0.36g) are mixed and added to the ball mill jar In the planetary ball mill, rotate at 400r / min, ball mill for 2h, then add dispersant (17000, 0.38g), and continue ball milling for 2h. Finally, a uniformly dispersed SiC slurry is obtained. The viscosity is lower than 3pa.s. Compared with Examples 1 and 2, the relative density and bending strength of SiC obtained in Example 3 are improved.

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Abstract

The invention relates to a photocured molding method for SiC ceramics and belongs to the field of molding of the SiC ceramics. The molding method comprises steps as follows: firstly, SiC ceramic powder, photosensitive resin and a photoinitiator are mixed and subjected to ball-milling, and uniformly dispersed SiC slurry is obtained; a SiC ceramic green body is printed by photocured molding equipment; after pyrolysis is performed, the SiC ceramic green body is transformed into a C / SiC green body; by means of high-temperature siliconizing, Si is subjected to an in-situ reaction with C in the C / SiC green body, and SiC is generated. With the adoption of the molding method, photocured molding preparation of the SiC ceramics is realized.

Description

technical field [0001] The invention relates to a photocuring molding method of silicon carbide ceramics, which belongs to the field of silicon carbide ceramic molding. Background technique [0002] Silicon carbide is widely used because of its stable chemical properties, high thermal conductivity, small thermal expansion coefficient, good wear resistance, high strength, and high hardness. Silicon carbide mainly has four major application areas, namely: functional ceramics, advanced refractories, abrasives and metallurgical raw materials. However, due to its brittle texture and high hardness, silicon carbide ceramics are difficult to process and shape. Traditional silicon carbide ceramic molding methods mainly include compression molding and colloidal molding. The traditional method of preparing silicon carbide has the following disadvantages: low precision, difficulty in preparing parts with complex shapes, and the need for molds and corresponding processing tools, result...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/565C04B35/573C04B35/622B33Y70/00
CPCB33Y70/00C04B35/565C04B35/573C04B35/622C04B2235/6026C04B2235/656C04B2235/6562C04B2235/6567C04B2235/6581C04B2235/96
Inventor 何汝杰丁国骄张可强张路白雪建冯成威方岱宁
Owner BEIJING INSTITUTE OF TECHNOLOGYGY