Photocured molding method for SiC ceramics
A technology of photocuring molding and silicon carbide ceramics, applied in the direction of additive processing, can solve the problems of high production cost, cutting molds, low precision, etc., and achieve the effect of eliminating development steps, fast molding speed, and high dimensional accuracy.
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Embodiment 1
[0022] A kind of silicon carbide ceramic photocuring molding method of the present invention, process flow chart is as follows figure 1 As shown, the specific molding steps are as follows:
[0023] 1) First, prepare 30ml of slurry, mix 28.9g of SiC ceramic powder, photosensitive resin (HDDA, 21.2g), photoinitiator (TPO, 0.58g) into the ball mill jar, and rotate at 400r / min on the planetary ball mill Under ball milling for 2h, then add dispersant (17000, 0.29g) and ball mill for 2h. Finally, a uniformly dispersed SiC slurry is obtained. The slurry viscosity is lower than 3pa.s.
[0024] 2) The SiC slurry obtained in step 1) is printed into a SiC ceramic green body using a light-curing molding device, and the SEM image is as follows figure 2 shown;
[0025] 3) Put the silicon carbide ceramic green body obtained by photocuring into a graphite crucible, and put it into a vacuum sintering furnace for pyrolytic carbonization. Heating rate: room temperature to 200°C: 3°C / min; 2...
Embodiment 2
[0029] Except for the following steps, other preparation steps are the same as in Example 1: In step 1, SiC ceramic powder (33.7g), photosensitive resin (HDDA, 19.7g), and photoinitiator (TPO, 0.39g) are mixed and added to the ball mill jar In the planetary ball mill, rotate at 400r / min, ball mill for 2h, then add dispersant (17000, 0.34g), and continue ball milling for 2h. Finally, a uniformly dispersed SiC slurry is obtained. The viscosity is lower than 3pa.s. Compared with Example 1, the relative density and bending strength of the obtained SiC parts are improved.
Embodiment 3
[0031] Except for the following steps, other preparation steps are the same as in Example 1: In step 1, SiC ceramic powder (38.4g), photosensitive resin (HDDA, 18.2g), and photoinitiator (TPO, 0.36g) are mixed and added to the ball mill jar In the planetary ball mill, rotate at 400r / min, ball mill for 2h, then add dispersant (17000, 0.38g), and continue ball milling for 2h. Finally, a uniformly dispersed SiC slurry is obtained. The viscosity is lower than 3pa.s. Compared with Examples 1 and 2, the relative density and bending strength of SiC obtained in Example 3 are improved.
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