Phenolic moulding material

Abstract

The invention discloses a phenolic moulding material and belongs to the technical field of thermosetting moulding materials. The phenolic moulding material is prepared from raw materials in parts by weight as follows: 25-40 parts of phenolic resin, 4-10 parts of a reinforcing agent, 2-5 parts of a curing agent, 25-35 parts of lignocellulose, 5-15 parts of reinforcing nanopowder, 0.5-2.0 parts of acoupling agent, 0.2-2.0 parts of a release agent and 5-10 parts of inorganic filler. The phenolic resin and the reinforcing agent are used in the formula, so that an adhesive system can be improved remarkably, the requirement of the injection molding technology is met on the premise that processability of the common phenolic moulding material is not lost, and the phenolic moulding material is suitable for high-efficiency industrial enlarged production; by means of the curing agent in the formula, the phenolic moulding material cannot cause corrosion to metal pieces when applied to products such as instruments and apparatus, and the service life of the products can be prolonged greatly.

Description

technical field [0001] The invention belongs to the technical field of thermosetting molding compounds, in particular to a phenolic molding compound. Background technique [0002] Phenolic molding compound is made of thermoplastic phenolic resin or thermosetting phenolic resin as the matrix, adding organic and inorganic fillers and other compounding agents. Phenolic resin and its molding compound are the earliest industrially produced varieties of synthetic resins and plastics, with a history of nearly 100 years. Based on their wide source of raw materials, simple production process and simple equipment, good molding processability, low price, and excellent heat resistance, mechanical properties, electrical properties, thermal properties, ablation properties, etc. can be obtained by various means. Chemical properties and radiation resistance, especially good flame retardancy, low smoke rate, and little harmful gas generation, have become indispensable materials for machiner...

AI Technical Summary

Problems solved by technology

[0003] Phenolic molding compound is an important molding material for the manufacture of instrumentation structures, but because the general phenolic molding compound is made of thermoplastic phenolic resin as the matrix, plus fillers, curing agents, curing accelerators, lubricants, colorants and plasticizers, etc. Composition, and its curing is by adding hexamethylenetetramine (urotropine), when at a certain temperature, hexamethylenetetramine decomposes and releases methylene to initiate phenolic resin curing, and at the same time due to hexamethylenetetramine Ammonia gas will inevitably be released when the tetramine is decomposed. Although most of it will volatilize, there will still be a small amount of free ammonia remaining in the product. These free ammonia will be continuously released during the use of the product, thus gradually affecting The metal components and electrical contacts of instruments and meters are corroded, which greatly reduces the safety and reliability of instruments and meters, and shortens the life of instruments and meters

[0004] Avoiding the use of hexamethylenetetramine as a curing agent in the material can make the phenolic molding compound produced without ammonia release. The traditional method is to use thermosetting phenolic resins, such as aniline-modified phenolic resins or liquid thermosetting phenolic resins. , but these two resins have different disadvantages: the synthesis end point of aniline-modified phenolic resin is not easy to control, it is easy to gel, and the reaction often causes incomplete discharge or different condensation degrees of the released resin; and if liquid The thermosetting phenolic resin, so the processing technology is more troublesome, and the output is lower

More typical ones such as "An ammonia-free phenolic molding compound and its preparation method" provided by the invention patent authorization announcement number CN100457822C, although the method does not generate ammonia gas when the molding compound is cured, but due to the melamine formaldehyde resin curing thermoplastic phenolic When used as a resin, the reactivity is relatively low, so a long curing time and a relatively high curing temperature are required, resulting in a relatively low output of the part, and the thermal rigidity, heat resistance temperature and mechanical strength of the part cannot be compared with ordinary phenolic Comparable to molding compounds, it is difficult to meet the requirements of industrial scale-up production