A method for testing the electrical properties of metallized grid lines of crystalline silicon solar cells
A technology of a solar cell and a test method, applied in the field of solar cells, can solve the problems that the contact resistance and the line resistance cannot be measured at the same time, and the test value cannot be quantified, so as to achieve the effect of helping and improving the plasticity and electrical properties.
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Embodiment 1
[0035] Step 1: texture the original single crystal silicon wafer: put the original single crystal silicon wafer into a solution of sodium hydroxide and additives with a volume ratio of 1:0.05 to corrode for 700s, pickle it and then dry it out; Wherein, the pickling solution is a mixed solution of hydrofluoric acid and hydrochloric acid.
[0036] Step 2: Divide the textured silicon wafers obtained in step 1 into two groups, wherein, group A is subjected to double-sided phosphorus diffusion, that is, the textured silicon wafers of group A are placed in a furnace where phosphorus oxychloride and oxygen are mixed The heating temperature in the tube is 750°C, the heating time is 800s, the doping square resistance is 70Ω / sq, and group B does not carry out any doping treatment;
[0037] Step 3: Both groups A and B are coated with silicon nitride film on both sides, that is, they are simultaneously placed in a chamber filled with plasma mixed with ammonia gas and silane to heat at 350...
Embodiment 2
[0042] Step 1: Texture the original single-crystal silicon wafer: put the original single-crystal silicon wafer into a solution of sodium hydroxide and additives with a volume ratio of 1:0.05 to corrode for 100,000s, pickle it and then dry it out; Wherein, the pickling solution is a mixed solution of hydrofluoric acid and hydrochloric acid.
[0043] Step 2: Divide the textured silicon wafers obtained in step 1 into two groups, wherein, group A is subjected to double-sided phosphorus diffusion, that is, the textured silicon wafers of group A are placed in a furnace where phosphorus oxychloride and oxygen are mixed The heating temperature in the tube is 800°C, the heating time is 1100s, the doping square resistance is 85Ω / sq , and group B does not carry out any doping treatment;
[0044] Step 3: Both groups A and B are coated with silicon nitride film on both sides, that is, they are simultaneously placed in a chamber filled with plasma mixed with ammonia gas and silane to heat ...
Embodiment 3
[0049]Step 1: texture the original single crystal silicon wafer: put the original single crystal silicon wafer into a solution of sodium hydroxide and additives with a volume ratio of 1:0.05 to corrode for 1350s, pickle it and then dry it out; Wherein, the solution of pickling is a mixed solution of hydrofluoric acid and hydrochloric acid.
[0050] Step 2: Divide the textured silicon wafers obtained in step 1 into two groups, wherein, group A is subjected to double-sided phosphorus diffusion, that is, the textured silicon wafers of group A are placed in a furnace where phosphorus oxychloride and oxygen are mixed The heating temperature in the tube is 800°C, the heating time is 1500s, the doping square resistance is 100Ω / sq, and group B does not carry out any doping treatment;
[0051] Step 3: Both groups A and B are coated with silicon nitride film on both sides, that is, they are simultaneously placed in a chamber filled with plasma mixed with ammonia gas and silane to heat a...
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