Mobile phone motherboard repair adhesive burst prevention method

Abstract

The invention relates to a mobile phone motherboard repair adhesive burst prevention method. The method includes the following steps that: a, a mobile phone motherboard to be repaired is arranged on amaintenance jig; b, a shielding cover is removed, each site, where an adhesive is applied, on the mobile phone motherboard, is heated; c, defective components are repaired or replaced after the adhesive is melt; and d, after the mobile phone motherboard is detected as a qualified one, the mobile phone motherboard is reassembled. According to the mobile phone motherboard repair adhesive burst prevention method, the specially made jig is manufactured, the adhesive dispensing position of the jig is additionally provided with a brass block; the heat of a chip end can be taken away by means of a heat conduction mode, and therefore, the heat of the solder ball of the chip does not exceed 217 DEG C during a continuous heating process; and therefore, an adhesive burst phenomenon can be effectively avoided; the repaired mobile phone motherboard and chip can be reused, resources can be saved, and companies' costs can be reduced.

Description

technical field [0001] The invention relates to the field of SMT, in particular to an explosion-proof adhesive method for repairing a mainboard of a mobile phone. Background technique [0002] Due to the design problem of the smart phone, about 0.1%-0.2% of the black screen will appear during the assembly process. It is necessary to remove the shielding cover at the dispensing component to replace the internal components, or to repair other components on the opposite side of the dispensing component. All boards need to be heated and repaired. However, due to the small size of the main board of the mobile phone and the high density of components, it is easy to overheat during heating and repairs, causing the original parts on the back to burst. Chip), replant the solder balls and then reinstall the board. The whole maintenance time will take about 30 minutes, and 15% of the board will be scrapped and 5% of the materials will be scrapped during the process, which will increase...

AI Technical Summary

Problems solved by technology

[0002] Due to the design problem of the smart phone, about 0.1%-0.2% of the black screen will appear during the assembly process. It is necessary to remove the shielding cover at the dispensing component to replace the internal components, or to repair other components on the opposite side of the dispensing component. All boards need to be heated and repaired. However, due to the small size of the main board of the mobile phone and the high density of components, it is easy to overheat during heating and repairs, causing the original parts on the back to burst. Chip), replant the solder balls and then reinstall the board. The whole maintenance time will take about 30 minutes, and 15% of the board will be scrapped and 5% of the materials will be scrapped during the process, which will increase the difficulty and time of maintenance, resulting in serious loss and quality Hidden danger

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