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Temperature equalization and heat dissipation integrated shielding cover and preparation method thereof

An integrated, shielding cover technology, applied in the field of shielding cover, can solve problems such as poor heat dissipation effect, and achieve the effects of improving adhesion, enhancing bonding force, and improving thermal conductivity.

Pending Publication Date: 2019-03-29
THERMAL GROUP TECH HUIZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing electronic equipment such as smart phones, game consoles, and projectors protect the normal operation of electronic chips and prolong the service life by setting shielded heat dissipation parts; the heat dissipation shields of existing electronic products are generally made of nickel nickel, stainless steel, and tinplate. There is no other coating on the surface to assist heat dissipation, and the overall heat dissipation effect is poor. How to provide a heat dissipation shield that integrates temperature uniformity and heat dissipation is a problem to be solved

Method used

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  • Temperature equalization and heat dissipation integrated shielding cover and preparation method thereof
  • Temperature equalization and heat dissipation integrated shielding cover and preparation method thereof
  • Temperature equalization and heat dissipation integrated shielding cover and preparation method thereof

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Embodiment 1

[0029] Figure 1-3 The schematic plan view, cross-sectional view and partial enlarged view of the shielding cover integrated with temperature uniformity and heat dissipation in this embodiment are respectively given, combined with reference Figure 1-3 , an integrated shielding cover for uniform temperature and heat dissipation, comprising a cover body 1, a graphene coating layer 1 2, and a graphene coating layer 2 3, wherein the cover body 1 is uniformly provided with a plurality of through holes 11, and the graphene coating layer Layer one 2 and graphene coating two 3 are respectively coated on the inside and outside of cover body 1, the length of graphene coating one 2 is shorter than the length of graphene coating two 3, graphene coating one 2 and graphene The cladding layer 2 3 is bonded together in the through hole 11, so that when the shielding cover is used to electromagnetically shield the target electronic component, the electromagnetic shielding performance of graph...

Embodiment 2

[0035] A method for preparing a shield cover integrated with temperature uniformity and heat dissipation, comprising the following steps:

[0036] S1. Provide the sheet material, and form the cover body by thermoforming the sheet material;

[0037] S2, punching the cover body, and evenly opening several through holes on the cover body;

[0038] S3, first brush the graphene slurry on the inner side of the cover body, send it into the baking device for baking, then apply the graphene slurry on the outside of the cover body, send it into the baking device for baking, and then cool and form; Wherein, the concentration of the graphene slurry is 0.1-20mg / mL, and the thickness range of the coating is 60-100 microns; the baking time is 5-30 minutes; the baking temperature is controlled at 120°C-160°C.

[0039] S4. Weld the cooling plate on the outer side of the cover body.

[0040] Wherein, before step S3, there is also a cleaning step to clean the cover body.

[0041] In step S1 o...

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Abstract

The invention discloses a temperature equalization and heat dissipation integrated shielding cover and a preparation method thereof. The shielding cover includes a cover body, a graphene cladding I, agraphene cladding II and a heat dissipation plate. The cover body is provided with a number of through holes. The graphene cladding I and the graphene cladding II respectively coat the inner and outer sides of the cover body. The graphene cladding I and the graphene cladding II are bonded together in the through holes. The heat dissipation plate is arranged on the outer side of the graphene cladding II. By arranging a number of through holes in the cover body of the shielding cover and coating the inner and outer sides of the cover body with graphene slurry, the heat generated by a target electronic component can be efficiently transferred to the outside of the shielding cover through the through holes, the graphene cladding I and the graphene cladding II when the target electronic component is electromagnetically shielded by the shielding cover. Therefore, a faster and more uniform heat dissipation effect is achieved, and the shielding cover has excellent electromagnetic shielding and heat conducting effects.

Description

technical field [0001] The invention relates to the technical field of shielding covers, and more particularly, to a shielding cover integrated with temperature uniformity and heat dissipation and a preparation method thereof. Background technique [0002] Existing electronic equipment such as smart phones, game consoles, and projectors protect the normal operation of electronic chips and prolong the service life by setting shielded heat dissipation parts; the heat dissipation shields of existing electronic products are generally made of nickel nickel, stainless steel, and tinplate. There is no other coating on the surface to assist heat dissipation, and the overall heat dissipation effect is poor. How to provide a heat dissipation shield integrating temperature uniformity and heat dissipation is a problem to be solved. Contents of the invention [0003] The main purpose of the present invention is to overcome the above-mentioned disadvantages, and provide an integrated sh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K9/00
CPCH05K7/20127H05K9/002
Inventor 谭弘平姜文新邓中应
Owner THERMAL GROUP TECH HUIZHOU