A method for making half-hole slices of glass fiber reinforced ptfe plate

Abstract

A method for manufacturing half-hole slices of glass fiber-reinforced PTFE boards, which relates to the field of printed circuit boards (PCBs). The positive and negative directions of the axial direction are alternately carried out; then finely grind the half-hole slice of the glass fiber reinforced PTFE plate with fine sandpaper; then polish the half-hole slice of the glass fiber reinforced PTFE plate with a short-haired polishing cloth; finally use a long-haired polishing cloth Polish the half-hole slices of glass fiber reinforced PTFE plates. By using different grinding sandpapers, different polishing cloths and grinding methods, the glass fibers are repeatedly stressed and broken by using different grinding sandpapers, different polishing cloths and grinding methods, and then using short wool The polishing cloth and the long-haired velvet cloth respectively assist in removing the glass fiber near the half hole, the glass fiber and the sticky debris in the deep hole, and realize the detailed and complete information of the half hole slicing hole wall of the glass fiber reinforced PTFE plate.

Description

technical field [0001] The invention relates to the field of printed circuit boards (PCBs), in particular to a method for making half-hole slices of glass fiber reinforced PTFE boards. Background technique [0002] In the production process of printed circuit boards (PCB), the occurrence and solution of product quality problems, and the improvement of the process all need to observe micro-sections (PCB half-hole slices) as the basis for research and judgment, and micro-sections are well done. Whether it is good or bad, how high its degree of reduction is, is a key factor in judging and studying the quality and process of PCB. For PTFE-based PCB boards reinforced with warp and weft interwoven glass fiber cloth, because they are mostly used in high-frequency transmission fields such as radar, the quality of the hole wall is extremely high, so how to obtain more detailed and complete hole wall information is the key to research. [0003] At present, the production of PCB half-...

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Problems solved by technology

The sample taken is basically plated with copper on the hole wall. This method can only observe the morphology of the glass fiber cloth and resin on the grinding surface after drilling (that is, when the half hole is ground, only the half hole groove can be observed. Two sides), it is difficult to speculate on the glass fiber cloth and resin drilling of the entire hole wall, and it is impossible to reflect the hole quality information completely. However, according to the experiment, it is known that the glass fiber reinforced PTFE board will exist in some special angles. There must be quality problems such as glass fiber separation, resin falling off, and voids, so this method cannot meet the observation requirements for making slices of this type of board.

[0004] At present, there are also half-hole slices that have not undergone the copper-immersion copper plating process. However, when the current simple sandpaper grinding method is used to make half-hole slices of glass fiber reinforced PTFE boards, due to the softness of the PTFE matrix, it is impossible to give the glass fiber cloth during grinding. Sufficient support prevents the glass fiber from being broken during grinding. When grinding to a half-hole, the glass fiber above the half-hole is pressed in the half-hole because it is not broken, and the information of the hole wall cannot be obtained.

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