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A kind of adduct of polyetheramine-epoxy resin and its preparation method and one-component epoxy composition with good storage property and its preparation method

An epoxy composition and epoxy resin technology, applied in the field of adhesives, can solve the problems of increased brittleness of the cured product of the composition, greater consumption of mechanical force and energy, and shortened storage period of the composition.

Active Publication Date: 2020-10-30
HANGZHOU ZHIJIANG NEW MATERIAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The viscosity of the reaction product in the first way will still be very high, which means that the dispersion of the composition in the preparation process needs to consume more mechanical force and energy; since the composition is a latent curing system, the addition of a catalyst will shorten the storage of the composition period, and the brittleness of the cured product of the composition will increase
The second way needs to add reactive diluent, which will increase the cost of the composition

Method used

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  • A kind of adduct of polyetheramine-epoxy resin and its preparation method and one-component epoxy composition with good storage property and its preparation method
  • A kind of adduct of polyetheramine-epoxy resin and its preparation method and one-component epoxy composition with good storage property and its preparation method
  • A kind of adduct of polyetheramine-epoxy resin and its preparation method and one-component epoxy composition with good storage property and its preparation method

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Experimental program
Comparison scheme
Effect test

preparation example Construction

[0031] The invention provides a method for preparing a polyetheramine-epoxy resin adduct for one-component epoxy structural adhesive, which is characterized in that it comprises the following steps:

[0032] Mix polyetheramine and epoxy resin and react to obtain polyetheramine-epoxy resin adduct, the stoichiometric ratio of epoxy group in the epoxy resin to active hydrogen of polyetheramine is 4:1 ~8:1.

[0033] When the present invention prepares the polyetheramine-epoxy resin adduct, polyetheramine and epoxy resin are used as raw materials, wherein, the present invention does not have special limitation to the kind of described polyetheramine and epoxy resin, and the skilled in the art All types of polyetheramines and epoxy resins that are known to be used in polyetheramine-epoxy resin adducts for one-component epoxy structural adhesives can be used in the present invention.

[0034] In the present invention, the polyetheramine is an amine-terminated polyether (such as a co...

Embodiment 1～3

[0083] Corresponding to the preparation of polyetheramine-epoxy adducts E2JD, E4JD, and E8JD

[0084] Huntsman's polyetheramine product Jeffamine D2000 and epoxy resin E51 are prepared according to the ratio in Table 1, react at 90-95°C for 1-2 hours and then discharge. The stoichiometric ratio, the products were named E2JD, E4JD, E8JD.

[0085] Table 1

[0086] Reactant E2JD E4JD E8JD Jeff-D2000(g) 140 140 140 E51(g) 110 220 440 Epoxy group: active hydrogen 2:1 4:1 8:1 Effective content of polyetheramine (%) 56％ 39％ 24％

[0087] The prepared polyetheramine-epoxy adduct is subjected to an accelerated aging test, and the specific test conditions are:

[0088] After the preparation is completed, place it at 23±1°C for 1 day, place the adduct in an oven with a set temperature of 50°C for curing, take out the sample every week to test the viscosity, the test condition is 23±0.5°C, and the shear rate of the rotational viscometer ...

Embodiment

[0093] Embodiment (EX1~EX10) and comparative example (ref0~ref3)

[0094] According to the mass parts of the raw materials in the ingredient list (Table 3 and Table 4), add epoxy resin, reactive diluent, (blocked) PU toughening agent, polyetheramine-epoxy resin adduct to the reactor in sequence Finally, the core-shell rubber and (resin-modified nitrile rubber) are evenly dispersed, and then filler, curing agent, and curing accelerator are added, mixed and stirred evenly, and vacuum defoaming to obtain an epoxy adhesive composition.

[0095] table 3

[0096]

[0097] Table 4

[0098]

[0099]

[0100] In Table 3 and Table 4, (PU toughener + effective content of polyetheramine)% # : The content of polyetheramine in E4JD is 9%, and the content of polyetheramine in E8JD is 24%;

[0101] Effective content of epoxy resin * : Contains pure epoxy resin, epoxy resin in polyetheramine-epoxy adduct, epoxy resin in core-shell rubber (~60%) and epoxy resin in resin-modified ni...

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Abstract

The invention provides a preparation method of an adduct of polyether amine-epoxy resin for a single component epoxy structural adhesive. When the polyether amine-epoxy resin is prepared, the chemometric ratio of epoxy groups in epoxy resin and reactive hydrogen of polyether amine is 4: 1 to 8: 1. As a result of too much epoxy resin, concentration of reactive hydrogen of polyether amine in a reaction system can be reduced greatly. The excessive epoxy resin molecules play a role of a dispersed phase to block formation of macromolecules, so that the chance of generating the macromolecules by thepolyether amine molecules and epoxy resin is reduced and the chance of forming linear macromolecules by the two is improved. At the same reaction temperature, the basic viscosity of the adduct can bereduced without prolonging the reaction time. Although the two react halfway, the viscosity is not increased too much even if the reaction is full as the resin is excessive greatly, so that the tackifying speeds are very low of the adduct and the composition are very low, and the storage stability of the product is ensured.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a one-component epoxy composition with good storage performance and a preparation method thereof. Background technique [0002] In the automobile manufacturing process, epoxy structural bonding instead of welding is becoming a technological development trend. Structural bonding has the advantages of light weight, high mechanical strength, reduced stress concentration, and good sealing. This kind of glue is one-component heat curing, and heat curing occurs in the paint baking process after glue application. However, as the types of substrates involved in bonding increase, when the thermal expansion coefficients of the two metal materials to be bonded differ greatly, the internal stress will be large due to this difference during the curing process of the glue, which will cause obvious deformation of the metal or the occurrence of glue. cracking. In order to solve t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L9/02C08L75/08C08K3/26C08G59/50
CPCC08G59/504C08K2003/265C08L63/00C08L2205/025C08L2205/035C08L2207/53C08L9/02C08L75/08C08K3/26
Inventor 桑广艺夏佳斌钱立飞陶小乐何永富
Owner HANGZHOU ZHIJIANG NEW MATERIAL CO LTD