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Heat-conducting glue for computer and preparation method thereof

A heat-conducting adhesive and computer technology, applied in the field of computers, to achieve the effect of wide source of raw materials, positive social benefits, and broad application prospects

Inactive Publication Date: 2019-04-09
南昌科悦企业管理咨询有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Existing thermally conductive adhesives for computers, such as the patent with the notification number CN 107880561 A, discloses a thermally conductive silica gel. Although this product improves the flame retardancy and heat resistance of thermally conductive adhesives, its thermal conductivity still needs to be further enhanced.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A thermally conductive adhesive for computers, comprising the following raw materials in parts by weight: 24.6 parts of methyl high phenyl vinyl silicone resin, 34 parts of phenyl vinyl silicone oil, 6.6 parts of polyurethane, 3.2 parts of flame retardant, and 8 parts of nano diatomite , 1.5 parts of coupling agent, 2.7 parts of sodium silicate, 4.6 parts of nano thermal conductive filler and 7.5 parts of fructooligosaccharide. The coupling agent is a silane coupling agent, the flame retardant includes a mixture of magnesium hydroxide and aluminum hydroxide, and the nano-thermal conductive filler includes a mixture of nano-boron nitride and nano-aluminum nitride. The particle diameter of the nano thermal conductive filler is 35nm, and the particle diameter of the nano diatomite is 70nm.

[0023] The preparation method of the thermally conductive adhesive for the computer, the specific steps are as follows:

[0024] Step 1, soak the nano diatomite in a hydrochloric acid...

Embodiment 2

[0029] A thermally conductive adhesive for computers, comprising the following raw materials in parts by weight: 25.7 parts of methyl high phenyl vinyl silicone resin, 35.2 parts of phenyl vinyl silicone oil, 7.7 parts of polyurethane, 3.45 parts of flame retardant, and 8.8 parts of nano diatomite , 1.8 parts of coupling agent, 3.2 parts of sodium silicate, 5.1 parts of nano thermal conductive filler and 8.2 parts of fructooligosaccharide. The relative molecular weight of fructooligosaccharides is 580-910. The particle diameter of the nano thermal conductive filler is 30nm, and the particle diameter of the nano diatomite is 60nm.

[0030] The preparation method of the thermally conductive adhesive for the computer, the specific steps are as follows:

[0031] Step 1, soak the nano diatomite in a hydrochloric acid solution with a mass fraction of 8-12% for 45-70 minutes, wash with water, dry and soak in a sodium hydroxide solution with a mass fraction of 10-15% for 20-25 Minut...

Embodiment 3

[0036] A thermally conductive adhesive for computers, comprising the following raw materials in parts by weight: 26.5 parts of methyl high phenyl vinyl silicone resin, 36.8 parts of phenyl vinyl silicone oil, 9.5 parts of polyurethane, 3.75 parts of flame retardant, and 9.7 parts of nano diatomite , 2.1 parts of coupling agent, 3.8 parts of sodium silicate, 5.5 parts of nano thermal conductive filler and 8.9 parts of fructooligosaccharide. The coupling agent is a titanate coupling agent, the flame retardant includes a mixture of magnesium hydroxide, antimony trioxide and aluminum hydroxide, and the nano thermal conductive filler includes a mixture of nano boron nitride and nano aluminum nitride. The relative molecular weight of fructooligosaccharides is 670-880. The particle diameter of the nano thermal conductive filler is 30nm, and the particle diameter of the nano diatomite is 90nm.

[0037] The preparation method of the thermally conductive adhesive for the computer, the ...

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Abstract

The invention discloses heat-conducting glue for a computer and a preparation method thereof. The heat-conducting glue is prepared from the following raw materials in parts by weight: 24.6-27.4 partsof methyl high phenyl vinyl silicone resin, 34-37.5 pats of phenyl vinyl silicone oil, 6.6-10 parts of polyurethane, 3.2-3.9 parts of a flame retardant, 8-10.6 parts of nano diatomite, 1.5-2.2 parts of a coupling agent, 2.7-4.1 parts of sodium silicate, 4.6-5.8 parts of nano heat-conducting filler and 7.5-9.2 parts of fructo-oligose. The heat-conducting glue provided by the invention is wide in source of raw materials. By modifying different raw materials with different processes and mixing and curing different products, a prepared product has more excellent heat-conducting coefficients and flame retardance, has a positive social benefit and is wide in application prospect.

Description

technical field [0001] The invention relates to the field of computers, in particular to a heat-conducting adhesive for computers. Background technique [0002] With the development of science and technology and the improvement of people's income, computers have become an inseparable tool in people's life, work and study. Computer, commonly known as computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logic calculations, and storage and memory functions. It is a modern intelligent electronic device that can run according to programs and process massive amounts of data automatically and at high speed. equipment. [0003] Computers bring convenience to people's various activities. With the development of microelectronics technology, electronic components are becoming thinner, lighter, smaller, and multifunctional. The assembly density of components is getting higher and higher. The heat dissipation of heating...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J175/04C09J11/04C09J11/08
CPCC08K2003/2224C08K2003/2227C08K2003/282C08K2003/385C08K2201/011C08L2201/02C08L2205/025C09J11/04C09J11/08C09J183/04C08L83/04C08L75/04C08K13/06C08K3/38C08K3/28C08K3/22C08K7/26
Inventor 徐尚
Owner 南昌科悦企业管理咨询有限公司