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Alignment device, method and equipment for double-sided exposure

A technology of double-sided exposure and alignment device, applied in the field of printed circuit boards, can solve problems such as inaccurate alignment of mark exposure apertures, and achieve the effect of improving accuracy

Active Publication Date: 2021-05-28
JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the existing problem of misalignment caused by the position of the mark exposure diaphragm caused by expansion and contraction or deformation of the vacuum chuck during the calibration interval, the present invention provides an alignment device for double-sided exposure, Method and exposure apparatus including alignment device for double-sided exposure

Method used

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  • Alignment device, method and equipment for double-sided exposure
  • Alignment device, method and equipment for double-sided exposure
  • Alignment device, method and equipment for double-sided exposure

Examples

Experimental program
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Embodiment 1

[0056] This embodiment provides an alignment device for double-sided exposure, see figure 1 , the device includes:

[0057] Positioning mark 11, marking mark 12 and position acquiring device 13;

[0058] The positioning mark 11 is used to determine the position of the marking mark 12 in real time, so as to determine the exposure pattern position of the sample to be exposed according to the position of the marking mark 12;

[0059] The marking mark 12 is used for marking the sample to be exposed;

[0060] The position obtaining device 13 is used for obtaining the position information of the positioning marker in real time.

[0061] The embodiment of the present invention provides an alignment device for double-sided exposure, including a positioning mark, a marking mark, and a position acquisition device, and the position information of the positioning mark is acquired in real time through the position acquisition device, thereby obtaining the real-time position information o...

Embodiment 2

[0063] This embodiment provides an alignment device and method for double-sided exposure, see figure 2 , the device includes:

[0064] positioning mark 11, marking mark 12, position acquisition device 13, sample carrying device 14 and marking device 15;

[0065] The positioning mark 11 is used to determine the position of the marking mark 12 in real time, thereby determining the exposure pattern position of the sample to be exposed according to the position of the marking mark 12;

[0066] The marking mark 12 is used for marking the sample to be exposed;

[0067] The position obtaining device 13 is used for obtaining the position information of the positioning marker in real time;

[0068] Wherein, the relative position variation of the positioning mark 11 and the marking mark 12 is less than a predetermined value, and the predetermined value is set according to the required alignment accuracy when the sample to be exposed is subjected to double-sided exposure; the distance...

Embodiment 3

[0096] This embodiment provides an alignment device and method for double-sided exposure, see figure 2 , the device includes:

[0097] positioning mark 11, marking mark 12, position acquisition device 13, sample carrying device 14 and marking device 15;

[0098] The positioning mark 11 is used to determine the position of the marking mark 12 in real time, thereby determining the exposure pattern position of the sample to be exposed according to the position of the marking mark 12;

[0099] The marking mark 12 is used for marking the sample to be exposed;

[0100] The position obtaining device 13 is used for obtaining the position information of the positioning marker in real time;

[0101] Wherein, the relative position variation of the positioning mark 11 and the marking mark 12 is less than a predetermined value, and the predetermined value is set according to the required alignment accuracy when the sample to be exposed is subjected to double-sided exposure; the distance...

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Abstract

The invention discloses an alignment device, method and equipment for double-sided exposure, and belongs to the technical field of printed circuit boards. The device includes: a positioning mark, a marking mark and a position acquisition device, and the position information of the positioning mark is acquired through the position acquisition device before each sample to be exposed is exposed, so as to know the position change of the positioning mark in actual production Since the relative position of the marking mark and the positioning mark remains unchanged, the position change of the marking mark in actual production can be known, and the position of the exposure pattern on the other side of the sample to be exposed can be adjusted in real time according to the position change. It solves the problem of inaccurate exposure alignment caused by the inability of the existing technology to perform real-time positioning of the marking marks in real time, and improves the alignment accuracy of both sides of the sample to be exposed.

Description

technical field [0001] The invention relates to an alignment device, method and equipment for double-sided exposure, and belongs to the technical field of printed circuit boards. Background technique [0002] When the laser direct imaging (LDI) exposure machine produces inner circuit boards, it is necessary to precisely align the images on both sides of the printed circuit board (PCB) to ensure the precise alignment of the graphics on both sides of the PCB. [0003] In the production process, laser marking is usually used to independently mark two marks for precise alignment of the inner PCB board. There is a mark exposure aperture at the bottom of the vacuum chuck. When performing exposure printing on the first side of the inner PCB, use the mark exposure aperture to mark two marks on the non-exposed area of ​​the edge of the other side of the PCB by laser marking. ; After flipping the board, calculate the rotation and translation of the PCB through the two mark coordinate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F9/00
CPCG03F9/7046G03F9/7073
Inventor 傅志伟
Owner JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD
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