Photosensitive resin composition and method of producing the substrate having the resin film thereof
A photosensitive resin and composition technology, applied in the field of substrate manufacturing, can solve the problems of insufficient film strength, insufficient film strength, rough surface, etc., and achieve the effects of excellent linearity, solvent resistance or alkali resistance.
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[0080] Hereafter, although an Example demonstrates this invention in detail, this invention is not limited to these Examples. The preparation example of the photosensitive resin composition used for the manufacturing method of resin film pattern formation of this invention is demonstrated, and the evaluation result of the characteristic of the hardened|cured material of the said photosensitive resin composition is demonstrated.
[0081] First, a synthesis example of (A) a polymerizable unsaturated group-containing alkali-soluble resin is shown. The evaluation of the resin in the synthesis example was performed as follows.
[0082] [Solid content concentration]
[0083] Impregnate 1 g of the resin solution obtained in the synthesis example into a glass filter [weight: W0 (g)] and weigh [W1 (g)]. According to the weight [W2 (g) after heating at 160°C for 2 hours ] and calculated using the following formula.
[0084] Solid content concentration (% by weight)=100×(W2-W0) / (W1-W0...
Synthetic example 1
[0110] 300 g of PGMEA was charged in a 1 L four-necked flask with a reflux cooler, and the inside of the flask system was replaced with nitrogen, and then the temperature was raised to 120°C. In the said flask, the monomer mixture (made by dissolving 10 g of AIBN in 77.1 g (0.35 mol) of DCPMA, 49.8 g (0.35 mol) of GMA, 31.2 g (0.30 mol) of St. mixture), and then stirred at 120° C. for 2 hours to obtain a copolymer solution.
[0111] Next, after replacing the inside of the flask system with air, 24.0 g of AA (95% of the glycidyl group), 0.8 g of TDMAMP, and 0.15 g of HQ were added to the obtained copolymer solution, and stirred under heating at 120° C. for 6 hr to obtain a solution containing Copolymer solutions of polymerizable unsaturated groups.
[0112] Furthermore, 30.0 g of SA (90% of the number of moles of AA added) and 0.5 g of TEA were added to the obtained polymerizable unsaturated group-containing copolymer solution, and reacted at 120° C. for 4 hours to obtain a po...
Synthetic example 2
[0114] BPFE 114.4g (0.23 mol), AA 33.2g (0.46 mol), PGMEA 157g, and TEAB 0.48g were put into a 500ml four-necked flask with a reflux cooler, and the reaction was carried out by stirring at 100°C to 105°C for 20 hours under heating. . Next, 35.3 g (0.12 moles) of BPDA and 18.3 g (0.12 moles) of THPA were put into the flask, and stirred under heating at 120° C. to 125° C. for 6 hours to obtain an alkali-soluble resin solution (A) containing polymerizable unsaturated groups. -2. The solid content concentration of the obtained resin solution was 56.1 mass %, the acid value (solid content conversion) was 103 mgKOH / g, and the Mw analyzed by GPC was 3600.
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Abstract
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