Soldering Materials
A soft soldering and quality technology, applied in the direction of welding/cutting medium/material, welding equipment, welding medium, etc., can solve problems such as damage, Sn thermal deformation, etc., and achieve improved reliability, improved product life, and high wettability Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 Embodiment approach
[0030] [First embodiment: Sn-Sb-Ag ternary system]
[0031] According to a first embodiment of the present invention, a soldering material containing 5.0% by mass to 8.0% by mass of Sb, 3.0% by mass to 5.0% by mass of Ag, and the balance consisting of Sn and unavoidable Alloys composed of impurities. Unavoidable impurities mainly refer to Cu, Ni, Zn, Fe, Al, As, Cd, Au, In, P, Pb, etc., but are not limited to them. The solder material of the present invention is a Pb-free lead-free solder alloy. By including Ag and Sb within the above-mentioned composition range in the solder material mainly composed of Sn, the high-temperature ductility becomes high. In addition, the solder material of this embodiment can secure relatively high wettability. When the amount of Ag added is less than 3.0% by mass, the ductility becomes large. This is because, Ag 3 The formation of the network structure of Sn and βSn is local, and the area of βSn with the highest ductility increases, so th...
no. 2 Embodiment approach
[0035] [Second embodiment: Sn-Sb-Ag-Ni quaternary system]
[0036] According to a second aspect of the present invention, a soldering material contains 5.0% by mass to 8.0% by mass of Sb, 3.0% by mass to 5.0% by mass of Ag, and furthermore, 0.05% by mass to 0.3% by mass. A lead-free solder alloy that does not contain Pb and consists of Ni at most mass % and the balance Sn and unavoidable impurities. This is because the high-temperature ductility of the solder material can be further improved as an advantage of further adding Ni in the above-mentioned addition range to the composition of the first embodiment. In such a range of Ni addition amount, 0.1 mass % or more and 0.25 mass % or less are especially preferable. This is because wettability is most excellent in this range.
[0037] The elongation at break of the solder material of the second embodiment at 100° C. is about 55%. This value is 108% or more with respect to the elongation at break of the Sn-8.5Sb-2.5Ag solder ...
no. 3 Embodiment approach
[0040] [Third embodiment: Sn-Sb-Ag-Ni-Ge quinary system]
[0041] According to a third embodiment of the present invention, a soldering material containing 5.0 mass % to 8.0 mass % of Sb, 3.0 mass % to 5.0 mass % of Ag, 0.05 mass % to 0.3 mass % % or less Ni, further containing 0.003 mass % or more and 0.01 mass % or less Ge, and the balance is a Pb-free lead-free solder alloy composed of Sn and unavoidable impurities. This is because, as an advantage of further adding Ge in the above-mentioned range to the composition of the second embodiment, the high-temperature ductility of the alloy can be further improved. In addition, it is because the oxidation of Sb is suppressed, which significantly contributes to the improvement of the wettability of the solder. When more than 0.01% by mass, for example, about 0.02% by mass of Ge is contained, air voids that become bonding defects are easily formed. The amount of Ge added is more preferably not less than 0.003% by mass and not mor...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| particle diameter | aaaaa | aaaaa |
| elongation at break | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More