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Tape for Bonding Film and Wafer Processing

一种接合膜、接合层的技术，应用在黏合剂添加剂、非高分子粘合剂添加剂、应用等方向，能够解决飞散并附着、污染半导体元件或基板、连接耐热性不充分等问题，达到提高机械强度的效果

Active Publication Date: 2021-07-02
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ACF has the following problems: in order to obtain a good bonding state, it contains more than a certain proportion of resin, so the contact between metal particles becomes point contact, sufficient heat conduction cannot be expected, and the connection heat resistance is not sufficient.
However, once the viscosity is lowered, there is a problem that when the metal paste is applied to the joint surface, the metal paste scatter and adhere to parts other than the joint surface of the semiconductor element or the substrate, thereby contaminating the semiconductor element or the substrate.

Method used

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  • Tape for Bonding Film and Wafer Processing
  • Tape for Bonding Film and Wafer Processing
  • Tape for Bonding Film and Wafer Processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0123] A release film (50 μm polyethylene terephthalate film) was placed on the mounting table, and a spacer made of SUS with a thickness of 350 μm and a circular opening of 6 inches in the center was placed thereon. The reinforcement layer (1) is placed on the facing release film at the opening, 5.0 g of the above-mentioned conductive paste (1) is placed on it, screen printing is performed using a squeegee, and the conductive paste is rolled and dipped. The conductive paste is infiltrated so as to be embedded in the pores of the porous body or mesh-like body constituting the reinforcement layer. Then, after removing the spacer, pre-drying was performed for 15 minutes in an inert atmosphere to form a conductive bonding layer.

[0124]Then, the above-mentioned adhesive layer composition (1) was applied by a spray coating method on the conductive bonding layer so that the film thickness after drying was 2 μm, and dried at 50° C. for 180 seconds to form an adhesive layer. Thus, ...

Embodiment 2

[0127] Except having used the strengthening layer (2) instead of the strengthening layer (1), it carried out similarly to Example 1, and obtained the tape for wafer processing of Example 2.

Embodiment 3

[0129] Except having used the strengthening layer (3) instead of the strengthening layer (1), it carried out similarly to Example 1, and obtained the tape for wafer processing of Example 3.

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Abstract

The present invention provides a bonding film and a tape for wafer processing capable of improving mechanical strength and thermal cycle characteristics in a semiconductor device in which a semiconductor element and a substrate are bonded. A bonding film, characterized in that it is a bonding film (13) for bonding a semiconductor element (2) and a substrate (40), and has a conductive bonding layer (13a), the conductive bonding layer (13a) It is obtained by filling the pores or meshes of the reinforcement layer containing porous bodies or mesh-like bodies with a conductive paste containing metal fine particles (P).

Description

technical field [0001] The present invention relates to a bonding film and a tape for wafer processing, and more particularly to a bonding film for connecting a semiconductor element to a substrate such as a circuit board or a ceramic substrate, and a tape for wafer processing including the bonding film. Background technique [0002] Conventionally, a film-like adhesive (die adhesive film) has been used for bonding a semiconductor chip to a wiring board or the like. A dicing / die-bonding tape has also been developed that simultaneously has the following two functions: a dicing tape for fixing the semiconductor wafer when the semiconductor wafer is diced and separated (diced) into individual chips, and a dicing tape for holding the diced semiconductor wafer A semiconductor chip is bonded to a die-attach film (also referred to as a die-bonding film) such as a wiring board (for example, refer to Patent Document 1). [0003] When such dicing and die-bonding tapes are used to con...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/20B32B5/28B32B7/027B32B7/025B32B7/022B32B27/00C09J1/00C09J7/21C09J9/02C09J11/04C09J11/06C09J201/00H01L21/301H01L21/52
CPCC09J201/00H01L24/27H01L24/83H01L2224/27436H01L2224/83191H01L2224/2929H01L24/29H01L2224/48091H01L2224/73265H01L2924/181H01L2224/32225H01L2224/32245H01L2224/48247H01L2224/48227H01L2224/45144H01L2224/45124H01L2224/45147H01L24/45H01L24/48H01L2224/85207H01L2224/29298H01L21/6836H01L2221/68327H01L2221/68336H01L2221/68377H01L2221/68381H01L23/3121C09J2203/326C08K3/08C08K2201/001H01L2224/92247H01L2224/29369H01L2224/29294H01L2224/2919H01L2224/29364H01L2224/29339H01L2224/05599H01L2224/834H01L2224/29344H01L2224/29355H01L2224/85399H01L2224/29347H01L2224/29386C09J7/205C09J2400/263C09J2400/163C09J2301/314C09J2301/41B32B2260/021B32B2457/14B32B2270/00B32B27/40B32B25/10B32B2274/00B32B27/34B32B25/08B32B15/02B32B27/08B32B15/085B32B2405/00B32B27/306B32B27/308B32B15/095B32B27/12B32B2262/106B32B27/302B32B2307/732B32B5/028B32B27/32B32B15/06B32B2264/105B32B2260/046B32B15/082B32B15/088H01L2224/8384H01L2924/00014H01L2924/00012H01L2924/00H01L2924/0544H01L2924/0105H01L2924/05432H01L2924/01031H01L2924/013H01L2924/01082H01L2924/0542H01L2924/0103H01L2924/054H01L2924/01028H01L2924/01013H01L2924/01046H01L2924/01032H01L2924/053H01L2924/01051H01L2924/01012H01L2924/06H01L2924/01025H01L2924/05341H01L2924/01078H01L2924/01049H01L2924/01083H01L2924/0541H01L2924/01079H01L2924/01047H01L2924/01022H01L2924/01029H01L2924/0532C09J7/50B32B7/12B32B2262/103B32B2307/202H01L21/565H01L24/32H01L24/73H01L24/85H01L24/92H01L2224/29005H01L2224/29083H01L2224/29147H01L2224/29155H01L2224/29184H01L2224/29193H01L2224/32221H01L2224/48106H01L2224/48221C09J11/04C09J7/20C09J7/21C09J1/00C09J11/06H01L21/52B32B5/28B32B7/02B32B27/00C09J9/02
Inventor 藤原英道新田纳泽福
Owner FURUKAWA ELECTRIC CO LTD