Cooking device top plate and manufacturing method for same
A cooker and top plate technology, which is applied in the field of cooker top plates, can solve the problems that the light-shielding layer cannot be formed sufficiently thick, the concealment cannot be obtained, and the light-shielding layer is prone to cracks, etc., and achieves the effect of high heat resistance
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no. 1 approach
[0034] like figure 1 As shown, a top plate 1 for a cooker (hereinafter, the “top plate 1 for a cooker” is simply referred to as “the top plate 1 ”) includes a glass substrate 2 . The glass substrate 2 has the conditioning surface 2b which is one main surface, and the back surface 2a which is the other main surface. The cooking surface 2b is a surface on which cooking utensils such as a pot or a frying pan are placed. On the other hand, the back surface 2a is the surface on the inner side of the cooker. The conditioning surface 2b and the back surface 2a face each other.
[0035] In this embodiment, the inorganic light-shielding layer 3 is provided on the back surface 2 a of the glass substrate 2 . A heat-resistant resin layer 4 is provided on the inorganic light-shielding layer 3 . In addition, in the present embodiment, the heat-resistant resin layer 4 is formed on the entire back surface 2 a of the glass substrate 2 .
[0036] The glass substrate 2 transmits at least a ...
no. 2 approach
[0077] figure 2 It is a schematic sectional view of the top plate 11 for cooking appliances of 2nd Embodiment of this invention. like figure 2 As shown, in the top plate 11 for a cooker, the inorganic light-shielding layer 3 is not provided, and the heat-resistant resin layer 4 is directly provided on the back surface 2 a of the glass substrate 2 .
[0078] In the second embodiment, the average particle diameter of the coloring pigment powder in the heat-resistant resin layer 4 is 0.3 μm or less. Therefore, as demonstrated in Examples below, for example, even when the top plate 11 reaches a high temperature of 400° C. or higher, the heat-resistant resin layer 4 is less likely to be discolored and thermally deteriorated less easily.
[0079] As shown in the second embodiment, a heat-resistant resin layer 4 may be provided immediately above the back surface 2 a of the glass substrate 2 . Moreover, as shown in 1st Embodiment, you may provide the heat-resistant resin layer 4 ...
Embodiment 1
[0082] First, 23.4% by mass of Cu-Fe-Mn-based black coloring pigment powder (average particle size: 0.2 μm), 23.4% by mass of talc as an extender pigment powder, and 29.9% by mass of silicone resin (resin solid content) are mixed , 23.2% by mass of an organic solvent was added to prepare a paste. Next, the paste was spread on a transparent crystallized glass plate (manufactured by NEC Glass Co., Ltd., trade name "N-0", average linear thermal expansion coefficient at 30°C to 750°C: 0.5×10 －7 / °C) was screen-printed so as to have a thickness of 4 μm as a whole. Thereafter, it was dried at 150° C. for 5 minutes and further fired at 300° C. for 30 minutes to form a heat-resistant resin layer and complete the top plate (top plate) for a cooker.
[0083] The prepared top plate was assembled in an electromagnetic heating device and the pot was fired in an empty state, thereby maintaining the top plate at 500° C. for 10 minutes (empty firing test). Thereafter, discoloration of the h...
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Abstract
Description
Claims
Application Information
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