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Active ray-sensitive or radiation-sensitive resin composition, pattern formation method, and electronic device production method

A technology of sensitizing rays and resin composition, which is applied in the photoplate-making process of the patterned surface, photosensitive material processing, instruments, etc., can solve the problems of damage to the exposure machine and difficulty in simultaneously satisfying the problem, and achieve excellent degassing performance and exposure tolerance Excellent effect

Active Publication Date: 2019-04-16
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] High functionality is required for various electronic devices, and at the same time, further improvement in the characteristics of resist patterns used in microfabrication is required. However, it is difficult to satisfy both resolution and line width roughness (Line width roughness) at the level required in the near future. : LWR) and other roughness characteristics and exposure latitude (Exposure Latitude: EL)
[0005] In addition, especially in the case of exposure by EUV light, the exposure is usually performed under vacuum, so gas derived from reactants in the exposed portion tends to be easily generated from the resist film, but this gas may damage the exposure machine.

Method used

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  • Active ray-sensitive or radiation-sensitive resin composition, pattern formation method, and electronic device production method
  • Active ray-sensitive or radiation-sensitive resin composition, pattern formation method, and electronic device production method
  • Active ray-sensitive or radiation-sensitive resin composition, pattern formation method, and electronic device production method

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Embodiment

[0508] Hereinafter, the present invention will be described in further detail through examples, but the present invention is not limited thereto.

[0509]

Synthetic example 1

[0510] Synthesis Example 1: Synthesis of Resin (A-19)

[0511]4.9 g of monomer (1), 6.7 g of monomer (2), 9.1 g of monomer (3) and 0.50 g of polymerization initiator V-601 (manufactured by Wako Pure Chemical Industries, Ltd.) were dissolved in 76.1 g of cyclohexanone. 41.0 g of cyclohexanone was put into the reaction container, and it was dripped in the system of 85 degreeC over 4 hours under nitrogen atmosphere. After the reaction solution was heated and stirred for 2 hours, it was cooled to room temperature. The reaction solution was added dropwise to 1377 g of a mixed solution of n-heptane and ethyl acetate (n-heptane / ethyl acetate=9 / 1 (mass ratio)) to precipitate a polymer, followed by filtration. The filtered solid was washed with 413 g of a mixed solution of n-heptane and ethyl acetate (n-heptane / ethyl acetate=9 / 1 (mass ratio)). Then, the washed solid was dried under reduced pressure to obtain 12.4 g of resin (A-19). The weight average molecular weight obtained by GP...

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Abstract

The present invention provides an active ray-sensitive or radiation-sensitive resin composition that comprises a resin and a compound capable of generating an acid upon irradiation with an active rayor radiation. The resin contains a repeating unit (a) represented by general formula (I-1) and a repeating unit (b) capable of forming a polar group as a result of desorption of a protecting group including a single ring by the action of an acid. (In the formula, R11 and R12 each independently represent a hydrogen atom or an alkyl group. R13 represents a hydrogen atom or an alkyl group, or a single bond or an alkylene group, and forms a ring by binding with L or Ar in the formula. L represents a single bond or a divalent linking group. Ar represents an aromatic ring. "n" represents an integerof 2 or more.)

Description

technical field [0001] The invention relates to an actinic radiation-sensitive or radiation-sensitive resin composition, a method for forming a pattern, and a method for manufacturing electronic devices. [0002] More specifically, the present invention relates to semiconductor manufacturing processes such as ICs, the manufacture of circuit boards such as liquid crystals and thermal print heads, and also relates to a photosensitive ray or photoresist used in photolithography processes of other photosensitive etching processes. Radiation-sensitive resin composition, method for forming a pattern, and method for manufacturing an electronic device comprising the method for forming a pattern. Background technique [0003] In conventional manufacturing steps of semiconductor devices such as IC (Integrated Circuit) and LSI (Large Scale Integrated Circuit), microfabrication is performed by photolithography using a resist composition. In recent years, with the high integration of in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/038G03F7/039
CPCG03F7/039G03F7/0392G03F7/0397C08F220/20C08F220/1806Y02P20/55G03F7/038C08F220/18C08F220/30C08F220/302G03F7/0045G03F7/16G03F7/168G03F7/20G03F7/2004G03F7/26G03F7/30G03F7/32G03F7/325G03F7/38
Inventor 二桥亘古谷创金子明弘椿英明平野修史
Owner FUJIFILM CORP