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Optical system, lithography apparatus and method

A technology of optical systems and lithography equipment, which is applied in the field of optical systems and can solve problems such as stress-induced changes and disadvantages

Active Publication Date: 2021-05-11
CARL ZEISS SMT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, point or line contact is disadvantageous in terms of the degree of so-called surface pressure between the two connection fittings
Undesirable stress-induced changes in the optical properties of the optic may result if the allowable surface pressure is exceeded

Method used

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  • Optical system, lithography apparatus and method
  • Optical system, lithography apparatus and method
  • Optical system, lithography apparatus and method

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Embodiment Construction

[0059] The same elements or elements with the same function have the same reference symbols in the figures, unless stated to the contrary. To the extent that a reference symbol has multiple reference lines in the present case, this indicates that there are multiple corresponding elements. Reference marker lines pointing to hidden details are shown in dashed form. It should also be noted that the drawings in the drawings are not necessarily drawn to scale.

[0060] Figure 1A A schematic diagram of an EUV lithographic apparatus 100A is shown, which includes a beam shaping and illumination system 102 and a projection system 104 . EUV stands for "extreme ultraviolet" and refers to working light with wavelengths between 0.1nm and 30nm. The beam shaping and illumination system 102 and the projection system 104 are respectively disposed in a vacuum enclosure (not shown in the figure), and each vacuum enclosure is evacuated with the assistance of a vacuuming device (not shown in th...

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Abstract

An optical system (200) for a lithographic apparatus (100A, 100B) having a first part (402), a second part (404) and an optical element (300), wherein the optical element (300) is force-fitted The joined means is held between a first part (402) and a second part (404) and is subjected to a clamping force (FK) for this purpose, wherein at least one of the parts (402, 404) comprises a contact optical element (300 ) and have support portions (412, 412', 426) of shape memory alloy.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from German patent application DE 10 2016 215 540.7 filed on 18.08.2016, the entire content of which is hereby incorporated by reference. technical field [0003] The present invention relates to an optical system for a lithographic apparatus, to a lithographic apparatus having such an optical system and to a method for manufacturing such an optical system. Background technique [0004] Microlithography is used to manufacture microstructured components, such as integrated circuits. The microlithography process is carried out by a lithography equipment including an illumination system and a projection system. The image of the mask (reticle) illuminated by the illumination system is in this case projected by the projection system onto a substrate (e.g. a silicon wafer) coated with a photosensitive layer (photoresist) and arranged in the projection system's in the image plane to transfer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G03F7/18G02B7/02
CPCG03F7/70825G03F7/7095G02B7/026G03F7/7015G02B7/1805
Inventor J.哈特耶斯
Owner CARL ZEISS SMT GMBH