Blue-light-sensitized silicon-based avalanche photodiode array device
A diode array, avalanche photoelectric technology, applied in electrical components, semiconductor devices, circuits, etc., can solve problems such as low blue light sensitivity, achieve uniform electric field distribution, reduce junction capacitance, and improve quantum efficiency.
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specific Embodiment approach 1
[0034] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT 1. This embodiment is described with reference to FIG. 1 to FIG. 5 . The blue light-sensitized silicon-based APD array device provided in this embodiment includes multiple detection units, multiple isolation regions 10 and multiple electrode leads 11 .
[0035] Among them, a plurality of detection units are regularly arranged to form an array, and each detection unit includes an anode 1, a non-depletion layer 2, an absorption layer 3, a field control layer 5, an avalanche layer 6, a substrate layer 7, a cathode 8 and a light-transmitting layer 9. The field control layer 5 , the absorption layer 3 and the non-depletion layer 2 are sequentially arranged on the upper surface of the avalanche layer 6 from bottom to top. A doped junction 4 is provided inside the absorption layer 3 , the lower surface of the doped junction 4 is in contact with the upper surface of the field control layer 5 , and there is a distance between the ...
specific Embodiment approach 2
[0043] Specific embodiment 2. For the parallel electrode structure array device, and the light-transmitting layer 9 and the anode 1 are all located on the same plane, the combination Image 6 To illustrate the present embodiment, the basic process steps are as follows:
[0044] Step 1. Select a highly doped n+ type silicon wafer as the substrate material of the APD, and perform cleaning treatment; the impurities are pentavalent elements such as P and As.
[0045] Step 2. Deposit a silicon epitaxial layer on the substrate material by techniques such as vapor phase epitaxy (VPE) or molecular beam epitaxy (MBE), as the p-type avalanche layer 6 of the APD; the grown epitaxial material is low doping concentration and low defect silicon.
[0046] Step 3, growing a p-type Si-based field control layer 5 on the avalanche layer 6 by vapor phase epitaxy or molecular beam epitaxy.
[0047] Step 4: After the field control layer 5 is prepared, a p-type Si-based absorption layer 3 is grown...
specific Embodiment approach 3
[0065] Specific embodiment 3. The manufacturing process for the case where part of the lower surface of the light-transmitting layer 9 of the blue-light-sensitized silicon-based APD array device is in contact with the non-depleted layer 2, and the remaining part is in contact with the upper surface of the anode 1: the specific Step 14 and Step 15 in Embodiment 2 are combined and changed to: prepare an anti-reflection film with a thickness of about 0.1-5 μm on the upper surface of the non-depleted layer 2 and the anode 1 by low-temperature evaporation method as the transparent layer of the APD. Light layer 9.
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