Unlock instant, AI-driven research and patent intelligence for your innovation.

Led lamp filament thixotropic adhesive and preparation method thereof

A technology of LED filament and thixotropic adhesive, which is applied in the direction of adhesives, adhesive additives, electrical components, etc., and can solve the problems of unguaranteed mixtures, easy agglomeration, and reduced light transmittance

Inactive Publication Date: 2019-05-07
绵阳华宝鼎业科技有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] But at present, many filament glue manufacturers often encounter the following problems in the process of mixing fumed silica: (1) Mixing uniformity problems: high thixotropic materials can only flow under high-speed shear conditions, so when silica is added to When a certain amount is used, the efficiency of stirring and mixing decreases, and it is difficult for silica to be "eaten" into the interior of the colloid and form a uniform mixture
(2) Consistency problem: fumed silica and nano-silica are easy to agglomerate themselves, and different degrees of agglomeration occur locally under the action of different shear forces and standing time after mixing, so that the mixture cannot guarantee a high consistency
(3) The problem of light transmittance reduction: due to the low dispersion efficiency of the ordinary stirring process, after adding more than 15% mass fraction of silica, the colloidal light transmittance is often reduced to below 70%, which affects the luminous effect of the bulb
LED filament lamps work in a closed environment, and there are low-molecular volatiles in the silicone encapsulant. After the filament lamp is lit, the surface temperature of the filament will reach 150°C. Long-term use will cause the volatilized substances to condense on the inner wall of the bulb, forming a A layer of oil film, serious and even cause fogging, which not only affects the appearance but also affects the light effect and light decay

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Led lamp filament thixotropic adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0039] The present invention also provides a preparation method of the filament thixotrope described in the above technical solution, comprising the following steps:

[0040] (1) Disperse the polyamide wax in a polar solvent under mechanical stirring, heat up to activate, add gas phase white carbon black to compound during activation, and then heat at high temperature to remove the solvent and small molecule oligomers in a vacuum, and cool to room temperature The compound thixotropic agent is obtained;

[0041] (2) Mix vinyl silicone resin, platinum catalyst, structure control agent, and tackifier in advance, and after mixing evenly, add compound thixotropic agent in batches under mechanical stirring to obtain component A;

[0042](3) Mix vinyl silicone resin, crosslinking agent and inhibitor uniformly to obtain component B;

[0043] (4) Mix the A component obtained in the step (2) with the B component obtained in the step (3) according to the mass ratio (0.8-2): 1, and obtai...

Embodiment 1

[0054] (1) Preparation of composite thixotropic agent:

[0055] Under mechanical stirring, weigh 1.5g of polyamide wax and evenly disperse it in a three-necked flask filled with 300ml of mixed solvent of xylene and isopropanol, and stir mechanically for 15min. After preliminary mixing evenly, raise the temperature to activate the mixed solution in a water bath at 50°C. After 10 minutes, slowly pour 8.0 g of fumed silica into a three-necked flask for compounding. After 1 hour, stop the reaction to obtain a compound thixotropic agent. Mixture. Then dry the mixed solution under vacuum at 150°C, remove the solvent and small molecular oligomers, etc., and cool to room temperature to obtain the composite thixotropic agent;

[0056] (2) Preparation of component A:

[0057] Weigh 9.18g of vinyl silicone resin, 0.06g of platinum catalyst, 0.2g of structure control agent, and 0.4g of tackifier in a vacuum stirrer, add 1.0g of compound thixotropic agent in 4 times at a stirring speed o...

Embodiment 2

[0063] (1) Preparation of composite thixotropic agent:

[0064] With embodiment 1;

[0065] (2) Preparation of component A:

[0066] Weigh 9.12g of vinyl silicone resin, 0.06g of platinum catalyst, 0.22g of structure control agent, and 0.4g of tackifier in a vacuum stirrer, add 1.1g of compound thixotropic agent in 4 times at a stirring speed of 500rpm, and mix After 10 minutes, continue stirring for 30 minutes to obtain component A.

[0067] (3) Preparation of component B:

[0068] Weigh 0.88g of vinyl silicone resin, 10.0g of cross-linking agent and 0.02g of inhibitor into a common stirring vessel, mix well to obtain component B.

[0069] (4) Preparation and use of filament thixotrope:

[0070] Clean the LED bracket to be packaged in advance and treat it at high temperature (150°C, more than 1h). Mix the above-mentioned components A and B with a mass ratio of 1:1, and dispense glue on the bracket after vacuum defoaming. The curing condition is heating at 80°C for 30min...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
Login to View More

Abstract

The invention discloses a LED filament thixotropic adhesive and a preparation method thereof, the thixotropic adhesive is composed of a component a and a component b, wherein the component a comprises25-100 parts by weight of vinyl silicon resin, 0.2-0.5 part of a catalyst, 0.4-1.8 parts of a structure control agent, 1-4 parts of a tackifier and 4-9 parts of a composite thixotropic agent, the component b consists of 2-6 parts by weight of vinyl silicon resin, 30-70 parts by weight of a cross-linking agent, and 0.05-0.2 part of an inhibitor, wherein the weight ratio of the component a to the component b is (0.8-2): 1. The LED filament thixotropic adhesive provided by the invention adopts the composite thixotropic agent, so that the problems that an existing LED filament lamp has the problems of oil mist, insufficient thixotropy and the like in the using process are effectively solved.

Description

technical field [0001] The invention relates to an LED packaging material, in particular to an LED filament thixotrope and a preparation method thereof. Background technique [0002] In recent years, policies prohibiting the sale of incandescent lamps have been gradually introduced around the world. As the most promising new-generation light source, LED has been widely used in the market due to its advantages of small size, long life, high luminous efficiency, energy saving and environmental protection. The appearance characteristics of LED filament lamps that resemble incandescent lamps can also meet the needs of differentiated and antique lamps in the market. [0003] Traditional LED packaging methods such as in-line LEDs, surface mount LEDs (SMD), chip-on-board (COB) and other LED lamp beads are planar light sources when optical devices such as lenses are not added. The innovative LED lamp bead column packaging is developed based on the concept of high-voltage LEDs, so ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J11/04C09J11/06C09J11/08H01L33/56
Inventor 陈才虎王敏牟林任沂
Owner 绵阳华宝鼎业科技有限公司