Unlock instant, AI-driven research and patent intelligence for your innovation.

Metallized ceramic substrate and manufacturing method thereof

A technology of metallized ceramics and substrates, applied in printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of inability to produce ultra-narrow line width and line spacing, inaccurate dimensions, high production costs, etc., and achieve simple etching and simplified process , low cost effect

Active Publication Date: 2021-05-28
井敏
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems existing in the prior art, such as serious side erosion, low quality, inaccurate size, high production cost, and inability to produce ultra-narrow line width and line spacing in the thicker metallization process, the present invention provides a The metallized ceramic substrate and its manufacturing method can quickly process ultra-narrow line width and line spacing graphics on the copper sheet, and there is no or greatly reduced side erosion phenomenon, so as to simplify the traditional process of film attachment, exposure, development and other processes, saving time , cost, simplified process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Metallized ceramic substrate and manufacturing method thereof
  • Metallized ceramic substrate and manufacturing method thereof
  • Metallized ceramic substrate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Such as figure 1 As shown, Al 2 o 3 -DBC ultra-narrow line width and line spacing production method

[0043] This case is used for Al 2 o 3 -DBC ultra-narrow line width and line spacing method, comprising the following steps:

[0044] S1. Machining a copper sheet with a size of 134mm*184mm*0.50mm on the copper surface by machining the designed graphics. The processing depth is 0.45 mm, and the scaling factor is selected to be between 1.05 and 1.5. In this embodiment, the scaling factor is 1.14, and the number of MARK points is set to 3. To determine the scaling factor, we first made a standard metal sheet, say 10*10, and then sintered the copper sheet onto the ceramic, cooled it down, and then tested the size to 11.4*11.4. We then know that the scaling factor is equal to 11.4 / 10=1.14. Of course, the copper scaling factors of different thicknesses are not the same, but the difference is small. The scaling factor for different thicknesses of copper can be measured...

Embodiment 2

[0050] Such as figure 2 Shown, zirconia toughened alumina (ZTA-DBC) ultra-narrow line width and line spacing manufacturing method

[0051] The method used in this case for ZTA-DBC ultra-narrow line width and line spacing includes the following steps:

[0052] S1. Process the designed graphics on the copper surface by laser processing on the copper sheet with the specification of 134mm*184mm*0.60mm. The processing depth is 0.46mm, the scaling factor considered is 1.18, and the MARK points are set to 2.

[0053] S2. Clean the impurities on the surface of the copper sheet with graphics by ultrasonic wave and weak alkaline 8848 cleaning solution.

[0054] S3. Pre-oxidize the non-pattern surface of the copper sheet through a pre-oxidation furnace. The oxygen concentration for pre-oxidation is about 300PPM.

[0055] S4. Superimpose the pre-oxidized graphic surface and the ZTA ceramic, and then pass through a sintering furnace to sinter together. The specification of alumina ce...

Embodiment 3

[0058] Such as image 3 As shown, the AlN-DBC ultra-narrow line width and line spacing manufacturing method

[0059] The manufacturing method used in this case for AlN-DBC ultra-narrow line width and line spacing includes the following steps:

[0060] S1. Machining a copper sheet with a size of 134mm*184mm*0.60mm on the copper surface by machining the designed graphics. The processing method is double-sided simultaneous processing. The processing depth is 0.40mm, the scaling factor considered is 1.2, and the MARK points are set to 2.

[0061] S2. Clean the impurities on the surface of the copper sheet with graphics by ultrasonic wave and weak alkaline 8848 cleaning solution.

[0062] S3. Pre-oxidize the pattern on the reverse side of the copper sheet through a pre-oxidation furnace. The oxygen concentration for pre-oxidation is about 300PPM.

[0063] S4, modifying the surface of the AlN ceramic to make the surface of the ceramic suitable for the DBC process.

[0064] S5, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses an ultra-narrow line width and line distance metallized ceramic substrate and a manufacturing method thereof, belonging to the field of component manufacturing. Aiming at the problems existing in the prior art, such as serious side erosion, low quality, inaccurate size, high production cost, and inability to produce ultra-narrow line width and line spacing in the thicker metallization process, the present invention provides a The metallized ceramic substrate with ultra-narrow line width and line distance and its manufacturing method process copper foil into required fine patterns by mechanical processing, laser etching, chemical etching or a combination of mechanical processing, laser etching and conventional chemical etching, and then Then sintering or welding on the ceramic surface, so as to achieve the purpose of fine line width and line spacing, and no side erosion phenomenon, to simplify the traditional process of film, exposure, development and other processes, save time, cost, and simplify the process.

Description

technical field [0001] The invention relates to the field of component manufacturing, and more specifically relates to a metallized ceramic substrate and a manufacturing method thereof. Background technique [0002] Existing technology: The current existing technology is to sinter metal sheets and ceramics together to form a metallized ceramic substrate, and then transfer the pattern to the metallized layer on the metallized ceramic substrate through filming, exposure, development, etc., and finally through chemical etching The pattern is then etched out. [0003] The existing technology also has a corresponding technology to provide narrow-pitch lines. For example, the Chinese patent application, application number 201710711171.9, published on December 12, 2017, discloses a new high-reliability laser etching process, including the following steps, S1: Prepare the FPC circuit board, PCB circuit board or ceramic integrated circuit board to be processed; S2: Prepare the laser...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/20H05K3/26
Inventor 井敏
Owner 井敏