A fabrication method of large-scale microfluidic channel based on ltcc process

Abstract

The invention discloses a method for manufacturing a large-scale microfluidic channel based on an LTCC process, which belongs to the technical field of components and devices. The steps include: making a sacrificial material prefabricated block rough blank and a supporting material prefabricated block rough blank, processing a composite sacrificial prefabricated block, and During the LTCC substrate lamination process, the composite sacrificial prefabricated block is put into the LTCC substrate green porcelain, and the composite sacrificial prefabricated block and the LTCC green porcelain substrate are pressed and sintered for further processing and forming; the large-scale micro-flow channel fabrication based on the LTCC process of the present invention technology, its advantages are simple materials, good process compatibility, easy processing, and the ability to manufacture large-scale micro-channels with a cross-sectional area of ​​20*0.35mm, which greatly reduces the difficulty of designing and processing micro-channel LTCC products; it also greatly enhances The cooling capacity of the LTCC substrate can meet the thermal management requirements of high heat flux density, which has strong practical value.

Description

Technical field [0001] The present invention relates to the field of components, and more particularly to a large-scale micro-track production method based on an LTCC process. Background technique [0002] As the system integration is improved, the size of the existing backward heat transfer, forced air-cooled or heat pipes can not meet the heat management requirements of local high-heat flow density devices, and internal calories cannot quickly and effectively disappear will result in devices fail. In order to solve the problem of high integration and miniaturization of three-dimensional packaging, it has developed a technique for integrated liquid-cooled micro-track in the module package in the internal integrated LTCC ceramic substrate, thereby realizing high-efficiency liquid cooling heat for high heat flow density devices. This technique is to place the sacrificial material in a reserved intake body during the production process of the LTCC ceramic substrate, and the sacrifi...

AI Technical Summary

Problems solved by technology

[0003] The disadvantages of the existing conventional micro-channels are: (1) Due to the limitation of the size of the micro-channels, when designing LTCC products, it is necessary to consider the direction and arrangement of the micro-channels so that as many micro-channels pass through as possible The bottom of the chip increases the difficulty of LTCC product design; (2) In order to achieve high cooling capacity, complex channel design is required, which brings great difficulties to the processing of microchannel LTCC substrates; (3) due to the existing The cross-section of the micro-channel is small, the flow resistance of the channel is too large, and the flow rate of the coolant in the channel is small. At the same time, the cross-sectional area of ​​the channel is small, and the heat exchange area of ​​the coolant is small, which limits the cooling capacity of the substrate and makes it unable to meet High heat flux thermal management requirements

Images