Polycarbonate imide resin and resin composition containing same

Abstract

This application provides (1) Adhesiveness (2) Insulation reliability (3) Humidification solder heat resistance (4) Solvent solubility, (5) Flame retardancy (6) B-stage adhesive film A polycarbonate imide resin excellent in brittleness resistance, a resin composition containing the same, and an electronic component having a solder resist layer, a surface protection layer, an interlayer insulating layer, or an adhesive layer obtained by curing the above resin composition. A kind of polycarbonate imide resin (A), is the polycarbonate imide resin (A) with the skeleton of specific structure, it is characterized in that, with the amide structure in polycarbonate imide resin (A) When the sum of the imide structure, the amic acid structure and the urea structure is 100 mol%, the content of the urea structure is 3 mol% or less.

Description

Polycarbonate imide resin and resin composition containing the same technical field [0001] The present invention relates to a polycarbonate imide resin and an adhesive using the resin, and further relates to Excellent insulation, flexibility, flame retardancy and fluidity, suitable for cover films, adhesive films, 3-layer copper clad laminates, etc. adhesive. Background technique [0002] Generally, a flexible printed circuit board (hereinafter also referred to as an FPC) is suitable for electronic equipment requiring flexibility or space saving Materials for wiring boards and mounting boards for components. For example, it is widely used in liquid crystal displays, plasma displays, Device mounting substrates for display devices used in mobile EL displays, etc., as well as smart phones, tablet terminals, digital cameras Board junction cables and operation switch boards for PCs, portable game machines, etc. [0003] In recent years, along with the miniaturization, th...

AI Technical Summary

Problems solved by technology

However, in general, high-boiling-point solvents such as N-methyl-2-pyrrolidone are used as solvents for wholly aromatic polyimide resin varnishes obtained by polymerizing only aromatic monomers. In this case, a curing process at a high temperature of 200°C or higher is required for a long time, and there is a problem of thermal deterioration of electronic components.

[0007] Further, since the glass transition temperature of the all-aromatic polyimide resin is generally high, the embedding property of the adhesive is poor when the adhesive is thermocompression-bonded to a substrate such as a polyimide film or copper foil, and there is a problem of adhesion. The problem of reduced strength

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