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Chip on film punching device, and display device assembling equipment and assembling system

A chip-on-film and punching technology is applied in the fields of chip-on-film punching devices, display device assembly equipment and assembly systems, and can solve problems such as misassembly of chip-on-film

Inactive Publication Date: 2019-06-07
HKC CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to propose a new chip-on-chip die-cutting device, display panel assembly equipment and its assembly system to solve the problem of incorrect assembly of chip-on-film due to the loose type comparison of chip-on-chip in the assembly process of display devices.

Method used

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  • Chip on film punching device, and display device assembling equipment and assembling system
  • Chip on film punching device, and display device assembling equipment and assembling system
  • Chip on film punching device, and display device assembling equipment and assembling system

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Embodiment Construction

[0033] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. A preferred embodiment of the invention is shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0035] In the...

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PUM

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Abstract

The invention relates to a chip on film punching device. The chip on film punching device comprises a rotating shaft, a punching structure and an identification structure, wherein the rotating shaft is used for being sleeved with a material reel wound with a chip on film material tape, the material reel is provided with a marking structure containing chip on film model information, and the material reel rotates along with the rotating shaft; the punching structure is used for pulling and punching the chip on film material tape; and the identification structure is used for identifying the marking structure so as to identify the chip on film model information. Through the arrangement of the identification structure, the chip on film model information is automatically identified in the punching process, a model signal is transmitted to display device assembling equipment for comparison, and therefore mis-assembly of batches of display panels can be avoided. The invention further relates to the display device assembling equipment used in cooperation with the chip on film punching device, through which the model information recognized by the chip on film punching device can be acquiredand compared. The invention further relates to a display device assembling system comprising the chip on film punching device and the display device assembling equipment.

Description

technical field [0001] The invention relates to the display field, in particular to a chip-on-film die-cutting device, display device assembly equipment and an assembly system. Background technique [0002] Chip-on-film is formed by packaging chips on a flexible circuit board. Usually, a roll of chip-on-film tape contains multiple chip-on-films. When chip-on-film is needed, it needs to be punched from the tape. cut it out. At present, the display panel in the display device is generally connected to the driving circuit board through the chip-on-chip film. During the assembly process of the display device, the chip-on-chip film strip is punched by a punching device to obtain a single chip of the chip-on-chip film and then assembled with the display panel. In order to avoid wrong model of the chip on film, the model of the chip on film will be entered into the system for judgment before the reel wrapped with the chip on film tape is set into the punching device. However, due...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/44B26D5/32B26D7/27
CPCB26D5/32B26F1/44B26D7/27
Inventor 王亮张光辉
Owner HKC CORP LTD