Hot melt adhesive for low-melting-point ceramic material and preparation method thereof
A technology of hot-melt adhesives and ceramic materials, applied in the field of functional materials, can solve the problems of easy liquefaction and collapse, lack of ceramic fillers, and failure to burn down, etc., to achieve simple process, easy access to raw materials and resources, and low cost Effect
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[0059] In order to describe in detail the technical content, purpose and effect of the hot-melt adhesive for low-melting point ceramic materials and its preparation method of the present invention, the following examples will be further described.
[0060] Twelve embodiment formulas and the measured results of their softening points have been optimized, as shown in Table 1.
[0061] See Table 2 for three preparation methods of preferred twelve embodiment formulas.
[0062] It can be seen from Table 1 that the softening point of "Example 10" has been lower than 500°C and reached 423°C.
[0063] The embodiment of the hot-melt adhesive for low-melting ceramic material of the present invention and its preparation method has beneficial technical effects as follows:
[0064] ④ The softening point of the hot melt adhesive is below 500°C, and can be as low as 423°C, which fully meets the technical requirements of ceramic fillers and ceramic polymer matrix composites with fillers;
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