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Hot melt adhesive for low-melting-point ceramic material and preparation method thereof

A technology of hot-melt adhesives and ceramic materials, applied in the field of functional materials, can solve the problems of easy liquefaction and collapse, lack of ceramic fillers, and failure to burn down, etc., to achieve simple process, easy access to raw materials and resources, and low cost Effect

Inactive Publication Date: 2019-06-07
深圳市锦昊辉实业发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0033] During the conversion process of high polymer being burnt to ceramic, it is easy to liquefy and collapse, and cannot maintain the original shape of the product
[0034] Further research also shows that the reason why the above-mentioned patent application has five major defects in functional design, ceramic polyolefin products have not yet obtained expert consensus and customer approval in the test, lack of market practicability, and have not been able to be put into industrial production so far. The ceramic filler lacks a sufficient amount of key important components of the "both ends" with a softening point below 500°C and a melting point above 950°C - low-temperature sintered hot-melt adhesive and a skeleton that does not collapse at ultra-high temperature

Method used

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Examples

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Embodiment Construction

[0059] In order to describe in detail the technical content, purpose and effect of the hot-melt adhesive for low-melting point ceramic materials and its preparation method of the present invention, the following examples will be further described.

[0060] Twelve embodiment formulas and the measured results of their softening points have been optimized, as shown in Table 1.

[0061] See Table 2 for three preparation methods of preferred twelve embodiment formulas.

[0062] It can be seen from Table 1 that the softening point of "Example 10" has been lower than 500°C and reached 423°C.

[0063] The embodiment of the hot-melt adhesive for low-melting ceramic material of the present invention and its preparation method has beneficial technical effects as follows:

[0064] ④ The softening point of the hot melt adhesive is below 500°C, and can be as low as 423°C, which fully meets the technical requirements of ceramic fillers and ceramic polymer matrix composites with fillers;

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PUM

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Abstract

The invention discloses a hot melt adhesive for a low-melting-point ceramic material and a preparation method of the hot melt adhesive. The binder comprises the following components in parts by weight: 1-50 parts of silicate, 5-70 parts of borate, 0-44 parts of carbonate, 0-70 parts of phosphate and 1-30 parts of halide. The composition is at least one of a mixture, a co-melt homogeneous substanceor a co-crystal homogeneous substance. The composition is at least one of fibrous, powdered or particulate in shape. The preparation method comprises two processes of a wire drawing method and a spraying method. The wire drawing method comprises the steps of raw material mixing, sealed high-temperature furnace melting, porous filter plate wire drawing, chopping and crushing. The spraying method comprises the steps of raw material mixing, sealed high-temperature furnace melting, porous filter plate spraying, and smashing. The working pressure of the sealed high-temperature furnace is 0.0-1.5 MPa, and the working temperature of the sealed high-temperature furnace is 300-1200 DEG C. The softening point of the hot melt adhesive can be as low as 423 DEG C. The method is simple in process, available in resources and low in cost, and large-scale industrialization is feasible in technical and economic aspects.

Description

technical field [0001] The invention belongs to the technical field of functional materials capable of converting broad-spectrum polymer base materials into ceramics under fire conditions, and specifically relates to the key to significantly reducing the ceramicization temperature of ceramic powders or polymer-based composite materials with fillers 1. Important additive technology, that is, hot-melt adhesive for ceramic materials with low melting point and its preparation method. Background technique [0002] Polymer-based composite materials with fillers, such as composite engineering plastics, coatings, adhesives, sealants, elastomers and foams, are favored due to their light weight, easy processing, easy availability of resources, and low price. Widely used in high-rise buildings, aerospace, submarines, rail transit, electronic power, information engineering, household appliances, machinery, chemicals and other fields. However, due to the flammability of most polymers, t...

Claims

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Application Information

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IPC IPC(8): C08K3/34C08K3/38C08K3/26C08K3/32C08K3/36C08K3/22C08K3/16
Inventor 肖扬华邓娇容甘祖荣常红丽
Owner 深圳市锦昊辉实业发展有限公司