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Multi-stage thermoelectric refrigerator structure and manufacturing method thereof

A thermoelectric cooler and thermoelectric technology, which is applied in the manufacture/processing of thermoelectric device parts, thermoelectric devices, and thermoelectric devices that only use the Peltier or Seebeck effect. problems such as low degree of precision, to achieve the effect of simple preparation process, reduced process cost, and high graphics accuracy

Inactive Publication Date: 2019-06-28
武汉利之达科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still some problems in ceramic circuit boards with multi-level thermoelectric coolers, mainly including: 1) The distance between thermoelectric material grains in ceramic circuit boards is relatively large, and the integration degree is low, resulting in low cooling power per unit area, which makes it difficult to meet heat dissipation requirements; 2) ) The inter-stage interconnection of the multi-level thermoelectric cooler in the ceramic circuit board needs to be separately arranged on the periphery of the ceramic circuit board, which reduces the reliability of the device; 3) In order to realize the welding of the ceramic circuit board and the multi-level thermoelectric cooler, it is necessary to select a Various metal solders with different melting points increase the complexity of the process; 4) The traditional wiring mode occupies a large area of ​​the ceramic substrate, resulting in a low installation density of thermoelectric particles on the substrate

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  • Multi-stage thermoelectric refrigerator structure and manufacturing method thereof
  • Multi-stage thermoelectric refrigerator structure and manufacturing method thereof
  • Multi-stage thermoelectric refrigerator structure and manufacturing method thereof

Examples

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Embodiment 1

[0057] Embodiment 1 of the present invention provides a multi-stage thermoelectric refrigerator using bismuth telluride material and its preparation method, such as Figure 7 shown, including the following steps:

[0058] Step 1: Select an alumina ceramic substrate, adopt laser drilling, sputtering coating, exposure and development, electroplating and etching, etc., to prepare upper and lower ceramic substrates 711, 713 containing metal pattern circuit layers, and metal pattern circuit layers and Vertical metal vias 74 in the middle ceramic substrate 712 . Among them, the metal graphic circuit layer 73 is designed according to the interconnection requirements of the thermoelectric particles 72; the thickness of the metal graphic circuit layer is 60 μm, the deposition method is electroplating copper, the processing accuracy is 50 μm, and the diameter of the vertical through hole is 100 μm. The number of vertical through holes can be Changes according to design requirements;

...

Embodiment 2

[0067] Embodiment 2 of the present invention provides another bismuth telluride material multi-stage thermoelectric refrigerator preparation method, such as Figure 7 shown, including the following steps:

[0068] Step 1: Select an alumina ceramic substrate, adopt laser drilling, sputtering coating, exposure and development, electroplating and etching, etc., to prepare upper and lower ceramic substrates 711, 713 containing metal pattern circuit layers, and metal pattern circuit layers and Vertical metal vias 74 in the middle ceramic substrate 712 . Among them, the metal graphic circuit layer 73 is designed according to the interconnection requirements of the thermoelectric particles 72; the thickness of the metal graphic circuit layer is 30 μm, the deposition method is electroplating copper, the processing accuracy is 30 μm, and the diameter of the vertical through hole is 50 μm; the number of vertical through holes can be Changes according to design requirements;

[0069] S...

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Abstract

The invention belongs to the field of electronic manufacturing and discloses a multi-stage thermoelectric refrigerator structure and a manufacturing method thereof. The thermoelectric refrigerator comprises a plurality of ceramic substrates, a plurality of thermoelectric particle layers, and a solder for connecting the plurality of ceramic substrates and the plurality of thermoelectric particle layers, wherein the ceramic substrates are a direct-plated ceramic substrate (DPC), the solder is a copper-tin alloy solder, and the stages of the multi-stage thermoelectric refrigerator are electrically interconnected by vertical through holes. The multi-stage thermoelectric refrigerator prepared by the invention is compact in structure, large in refrigeration power and high in reliability.

Description

technical field [0001] The invention belongs to the technical field of electronic manufacturing, and in particular relates to a multi-stage thermoelectric refrigerator and a preparation method thereof. Background technique [0002] Thermoelectric coolers (TECs) have the advantages of no refrigerant, no moving parts, and convenient cooling / heating switching, and are widely used in electronics, medical, military and other fields. As the working environment of electronic devices becomes more and more harsh, new requirements are put forward for their heat dissipation capabilities. High-performance thermoelectric cooling chips are conducive to reducing the local temperature of chips and improving their service life. [0003] At present, thermoelectric coolers generally use thick film ceramic substrates (TFC) or direct bonded copper ceramics (DBC), and the ceramic substrate containing the circuit layer and the thermoelectric material grains are welded together by metal solder. In...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/32H01L35/08H01L35/10H01L35/34H10N10/17H10N10/01H10N10/817H10N10/82
Inventor 陈明祥刘晨刘松坡黄卫军
Owner 武汉利之达科技股份有限公司