Packaging structure of an organic electroluminescent device

Abstract

The invention provides a packaging structure of an organic electroluminescent device, comprising a substrate (001), an electroluminescent device (002), a packaging glue (003), a cover plate (004) and a non-water-absorbing filling material (005); The non-absorbent filling material (005) is arranged between the electroluminescent device (002) and the cover plate (004); between the non-absorbent filling material (005) and the electroluminescent device (002), a A layer of liquid desiccant A (006) is used to remove water vapor on the surface of non-absorbent filling materials, and its thickness shall not cause particle agglomeration. The packaging structure of the organic electroluminescence device provided by the present invention uses the filling material to partially replace the desiccant, which preserves the advantages of the existing flat cover plate and liquid desiccant packaging device, and improves the reliability of the device and better heat conduction. Improved device lifetime, energy efficiency, and reduced short circuits in large-sized devices increase device reliability and reduce device cost.

Description

technical field [0001] The invention relates to a package structure of an organic electroluminescent device, which belongs to the field of display and lighting. Background technique [0002] Organic electroluminescent devices, electroluminescence, have attracted more and more attention from scholars and enterprises in the field of lighting and display due to their advantages of energy saving, health, thinness, environmental protection, self-illumination, short response time, simple structure, and flexibility. , with broad prospects for development. [0003] The structure of an electroluminescent device generally includes a substrate, on which two thin-film electrodes are fabricated, and a multi-layer organic thin film is fabricated between the two electrodes, and the device emits light after electricity is applied between the two electrodes. The most commonly used substrate is made of transparent glass. After the device is powered on, the light emitted by the device passes ...

AI Technical Summary

Problems solved by technology

But this technology also has its problems, mainly because when water vapor penetrates through the encapsulant, only the desiccant in the outermost ring that directly contacts the encapsulant has the function of absorbing water, while the desiccant in the middle area only plays the role of filling and heat dissipation Effect, because the water-absorbing material of the liquid desiccant is Particle-like (granular), which will cause agglomeration, and the formation of a large Particle will cause a short circuit of the device after being pressed

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