Vacuum sintering device and organic layer sintering process
A vacuum sintering and organic layer technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of laser bubble generation, packaging failure, and the absence of organic layers.
Active Publication Date: 2019-06-28
BOE TECH GRP CO LTD +1
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Problems solved by technology
However, in the existing packaging process, due to the material characteristics of the packaging glue, there should be no organic layer at the hole drilling position, otherwise it will cause laser bubbles to be generated, and even lead to package failure
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[0031] Typical embodiments that embody the features and advantages of the present disclosure will be described in detail in the following description. It should be understood that the present disclosure can have various changes in different embodiments without departing from the scope of the present disclosure, and that the description and drawings therein are illustrative in nature and not intended to limit the present disclosure. public.
[0032] In the following description of various exemplary embodiments of the present disclosure, reference is made to the accompanying drawings, which form a part hereof, and in which are shown, by way of example, various exemplary structures, systems, which may implement aspects of the present disclosure and steps. It is to be understood that other specific arrangements of components, structures, exemplary devices, systems and steps may be utilized and structural and functional modifications may be made without departing from the scope of...
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Abstract
The invention provides a vacuum sintering device and an organic layer sintering process. The vacuum sintering device is used for the laser sintering of the organic layer of a back plate. The vacuum sintering device comprises a body, a cover plate, a taking and placing mechanism and a laser source mechanism. The body has a vacuum chamber for accommodating the back plate. The cover plate is made ofa transparent material. The taking and placing mechanism is arranged in the vacuum chamber and is configured to place the cover plate on the back plate or move away the cover plate placed on the backplate. The laser source mechanism is arranged in the vacuum chamber. When the cover plate is located on the back plate, the laser emitted by the laser source mechanism penetrates through the cover plate to irradiate the back plate. Vaporized organic matters formed by sintering and vaporizing the organic layer of the back plate are blocked by the cover plate.
Description
technical field [0001] The present disclosure relates to the technical field of processing semiconductor devices, in particular to a vacuum sintering device and an organic layer sintering process. Background technique [0002] At present, smart watch products on the market have begun to show a demand trend for mechanical hands. However, in the process of punching holes in the display area, considering that the increase in the number of holes to be dug by the vapor-deposited screen will easily cause poor color mixing on the backplane, the vapor-deposited screen used in the prior art does not have a groove design for the full-screen grooved area. , using full-screen evaporation technology to correspond. Therefore, the holes must be covered with EL (Electro-Luminescence) organic materials. However, in the existing encapsulation process, the encapsulation glue cannot have an organic layer at the perforation position due to its material characteristics, otherwise it will cause ...
Claims
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IPC IPC(8): H01L51/56H01L51/52
Inventor 贾丹杨龙龙
Owner BOE TECH GRP CO LTD