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Method for manufacturing super-strength microneedle array

A technology of microneedle array and manufacturing method, which is applied in the field of microneedle array, can solve problems such as microneedle hardness surface pits, etc., and achieve the effect of easy operation and broad development prospects

Inactive Publication Date: 2019-07-16
苏州应汝电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But there are inevitably some weaknesses, such as the hardness of the microneedles and the problem of surface pits

Method used

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  • Method for manufacturing super-strength microneedle array
  • Method for manufacturing super-strength microneedle array
  • Method for manufacturing super-strength microneedle array

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A method for manufacturing a super-strength microneedle array, the method for manufacturing a super-strength microneedle array includes the following steps:

[0025] S1: The PMMA microneedle array is used as the original mold, and the PMMA microneedles are fabricated by using mobile X-ray exposure.

[0026] S2: The PMMA microneedle made in S1 is passed through the PDMS rotary mold to form a secondary mold, and a layer of conductive material is coated on the basis of PDMS. The conductive material is chromium / copper, and the chromium / copper is coated on the PMMA microneedle Sputtering was performed on the surface to make a PMMA microneedle array chromium / copper seed layer.

[0027] S3: Carry out nickel / diamond composite electroplating on the basis of S2; And add pit inhibitor in the process of nickel / diamond composite electroplating.

Embodiment 2

[0029] A method for manufacturing a super-strength microneedle array, the method for manufacturing a super-strength microneedle array includes the following steps:

[0030] S1: The PMMA microneedle array is used as the original mold, and the PMMA microneedles are fabricated by using mobile X-ray exposure.

[0031] S2: The PMMA microneedle made in S1 is passed through the PDMS rotary mold to form a secondary mold, and a layer of conductive material is coated on the basis of PDMS. The conductive material is chromium / copper, and the chromium / copper is coated on the PMMA microneedle Sputtering was performed on the surface to make a PMMA microneedle array chromium / copper seed layer.

[0032] S3: Carry out nickel / diamond composite electroplating on the basis of S2; And add pit inhibitor in the process of nickel / diamond composite electroplating.

[0033] In step S3, in the nickel / diamond composite electroplating process, an electrolyte consisting of a main salt, a conductive salt, a...

Embodiment 3

[0035] A method for manufacturing a super-strength microneedle array, the method for manufacturing a super-strength microneedle array includes the following steps:

[0036] S1: The PMMA microneedle array is used as the original mold, and the PMMA microneedles are fabricated by using mobile X-ray exposure.

[0037] S2: The PMMA microneedle made in S1 is passed through the PDMS rotary mold to form a secondary mold, and a layer of conductive material is coated on the basis of PDMS. The conductive material is chromium / copper, and the chromium / copper is coated on the PMMA microneedle Sputtering was performed on the surface to make a PMMA microneedle array chromium / copper seed layer.

[0038] S3: Carry out nickel / diamond composite electroplating on the basis of S2; And add pit inhibitor in the process of nickel / diamond composite electroplating.

[0039] In step S3, in the nickel / diamond composite electroplating process, an electrolyte consisting of a main salt, a conductive salt, a...

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Abstract

The invention discloses a method for manufacturing a super-strength microneedle array which comprises the following operation steps: S1, taking a PMMA microneedle array as an original mold, and exposing and manufacturing PMMA microneedles by utilizing mobile X rays; S2, transferring the PMMA microneedle prepared in the step S1 through PDMS to form a secondary mold, coating a layer of conductive material on the basis of PDMS, and sputtering chromium / copper on the surface of the PMMA microneedle so as to prepare a chromium / copper seed layer of the PMMA microneedle array; S3, conducting nickel / diamond composite electroplating on the basis of the step S2; and adding a pit inhibitor in the nickel / diamond composite electroplating process. By means of the mode, the nickel / diamond microneedle array has the advantages of being free of damage, high in strength and easy to operate, the diamond needle point is beneficial to enabling quantum nano sensing to be more cost-effective and practical, andthe nickel / diamond microneedle array can also be used for conducting high-sensitivity nano-scale measurement such as an electromagnetic field, temperature or stress. In China, the super-strength microneedle array is still deficient, and the development prospect is wide.

Description

technical field [0001] The invention relates to a microneedle array, in particular to a method for manufacturing a super-strength microneedle array. Background technique [0002] In recent years, with the rapid development of MEMS technology, the manufacture and processing of microneedle arrays in the biomedical field has become more and more mature. As a minimally invasive, cost-effective method to improve drug delivery efficiency, microneedle arrays have attracted widespread attention. But there are inevitably some weaknesses, such as the hardness of the microneedles and the problem of surface pits. Contents of the invention [0003] The technical problem mainly solved by the present invention is how to provide a designed nickel / diamond microneedle array with the advantages of non-damage, high strength and easy operation, and the diamond tip helps to make quantum nano-sensing more cost-effective and Practically, it can also be used in ultra-strong microneedle array fabr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
CPCB81C1/00111
Inventor 李以贵王欢张成功王洁蔡金东金敏慧
Owner 苏州应汝电子科技有限公司