Thin electrode brazing ceramic tube shell with silver resisting structure
A technology of ceramic shell and silver resistance, applied in the direction of manufacturing tools, welding equipment, auxiliary devices, etc., can solve the problems of solder overflow, extend the distance from silver solder to the electrode surface, etc., to extend the distance and prevent overflow to the electrode table , the effect of improving the pass rate
Pending Publication Date: 2019-07-19
江阴市赛英电子股份有限公司
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a thin-type electrode brazing ceramic shell with a silver-resistant structure for the above-mentioned prior art, which can significantly extend the distance from the silver solder to the electrode surface and solve the problem of solder overflow on the thin-type electrode table
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[0011] The present invention will be further described in detail below with reference to the embodiments of the accompanying drawings.
[0012] like figure 1 As shown, a thin electrode brazed ceramic tube shell with a silver-blocking structure in this embodiment includes an upper cover 1 and a ceramic base 2 that can be covered with each other, and the upper cover 1 is placed on the ceramic base 2 superior.
[0013] The upper cover 1 includes a cathode electrode 1.1 and a cathode flange 1.2. Three cathode silver resistance steps 1.3 are opened on the outer edge of the cathode electrode 1.1. The three cathode silver resistance steps 1.3 are formed by the lower part of the cathode electrode 1.1. The end face is continuous from the upper end face, the cathode flange 1.2 is concentrically welded on the outer edge of the middle cathode silver blocking step of the cathode electrode 1.1, and is flat with the stepped surface of the middle cathode silver blocking step, under the catho...
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The invention relates to a thin electrode bracing ceramic tube shell with a silver resisting structure. The thin electrode bracing ceramic tube shell with the silver resisting structure comprises an upper cover and a ceramic base. The upper cover comprises a cathode electrode and a cathode flange. The ceramic base comprises an anode flange, a ceramic ring, an anode electrode and an anode sealing ring. The outer edge of the cathode electrode is provided with at least three continuous silver resisting steps. The cathode flange is concentrically welded to the outer edge of the silver resisting step of a middle cathode of the cathode electrode. The outer edge of the anode electrode is provided with at least three continuous anode silver resisting steps. The inner edge of the anode sealing ringis concentrically welded to the outer edge of the silver resisting step of the middle anode of the anode electrode. According to the thin electrode bracing ceramic tube shell, multi-step silver resisting design is carried out on the electrodes at the positions of the electrode flange and the electrode, the surface between silver solder and the surfaces of the electrodes is remarkably increased, the silver solder can be prevented from overflowing to an electrode table face in the bracing process, and the yield of a product is increased.
Description
technical field [0001] The invention relates to a thin electrode brazed ceramic tube shell with a silver resistance structure, belonging to the technical field of power electronics. Background technique [0002] Under the guidance of the basic national policy of energy saving and emission reduction and building a resource-saving economy, the miniaturization, light weight and modularization of power electronic devices and devices has become one of the current development trends. It can not only effectively reduce the weight and volume of the device, but also expand the cavity space of the ceramic tube to meet the modular packaging of new devices such as crimp IGBTs. requirements. [0003] However, during the brazing process of thin electrodes, since the solder position is very close to the electrode table, the solder is very easy to overflow to the electrode table, which will change the electrothermal performance of the electrode surface, which is not allowed by the device p...
Claims
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Login to View More IPC IPC(8): B23K3/08
CPCB23K3/08
Inventor 陈强张琼
Owner 江阴市赛英电子股份有限公司