Shutter mechanism for target, and film-forming device provided with same
A technology of shielding parts and shielding plates, applied to electrical components, ion implantation plating, coatings, etc., can solve problems such as difficult to ensure avoidance space, complex structure, and poor operation
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[0027] Preferred embodiments of the present invention will be described with reference to the drawings.
[0028] Figure 1 to Figure 3 A film forming apparatus 1 according to a first embodiment of the present invention is shown. This film forming apparatus 1 is an apparatus for forming a film on a substrate W by sputtering, and includes a film forming chamber 2 for accommodating the substrate W, a plurality of targets 3, a sputtering source 4 for applying a voltage for sputtering to the targets 3, a mounted The substrate mounting part 5 of the substrate W and the plurality of shutter mechanisms 10 having the shutters 6 that open and close between each of the plurality of targets 3 and the substrate W are provided.
[0029] Each of the aforementioned plurality of targets 3 has a substrate-facing surface 30 that faces the substrate W. As shown in FIG. In the film forming apparatus 1, a voltage is applied from the sputtering source 4 to each of the plurality of targets 3 in a s...
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