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Shutter mechanism for target, and film-forming device provided with same

A technology of shielding parts and shielding plates, applied to electrical components, ion implantation plating, coatings, etc., can solve problems such as difficult to ensure avoidance space, complex structure, and poor operation

Active Publication Date: 2019-07-19
KOBE STEEL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In other words, it is difficult to secure the escape space around the target inside the vacuum chamber due to the miniaturization of the film forming apparatus.
[0008] In addition, the aforementioned shutter mechanism requires a complicated structure in order to be able to perform both the aforementioned linear movement and rotation.
This increases the possibility that fragments of the film generated during the film formation process will adhere to the moving mechanism and cause malfunction of the shutter mechanism.

Method used

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  • Shutter mechanism for target, and film-forming device provided with same
  • Shutter mechanism for target, and film-forming device provided with same
  • Shutter mechanism for target, and film-forming device provided with same

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Embodiment Construction

[0027] Preferred embodiments of the present invention will be described with reference to the drawings.

[0028] Figure 1 to Figure 3 A film forming apparatus 1 according to a first embodiment of the present invention is shown. This film forming apparatus 1 is an apparatus for forming a film on a substrate W by sputtering, and includes a film forming chamber 2 for accommodating the substrate W, a plurality of targets 3, a sputtering source 4 for applying a voltage for sputtering to the targets 3, a mounted The substrate mounting part 5 of the substrate W and the plurality of shutter mechanisms 10 having the shutters 6 that open and close between each of the plurality of targets 3 and the substrate W are provided.

[0029] Each of the aforementioned plurality of targets 3 has a substrate-facing surface 30 that faces the substrate W. As shown in FIG. In the film forming apparatus 1, a voltage is applied from the sputtering source 4 to each of the plurality of targets 3 in a s...

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Abstract

Provided is a shutter mechanism for opening and closing a substrate-facing surface (30) of a target (3). The shutter mechanism is provided with: a shutter (6) having first and second shutter plates (11A, 11B) having first and second edge parts (30a, 30b), respectively; and first and second rotary support parts (13A, 13B) for supporting the first and second shutter plates (11A, 11B) so as to be able to rotate about first and second rotary shafts (SA, SB) extending in the direction of a line normal to the substrate-facing surface (30) so that the first and second shutter plates (11A, 11B) can move between an open position and a closed position at which the first and second edge parts (30a, 30b) overlap. The first and second rotary shafts (13A, 13B) are disposed so as to be divided toward both sides with an overlap region of the first and second edge parts (30a, 30b) therebetween so that the first and second edge parts (30a, 30b) in the open position thereof extend along sides of the substrate-facing surface (30).

Description

technical field [0001] The present invention relates to a target shutter mechanism for covering a target used for sputtering in an openable and closable manner, and a film forming apparatus including the target shutter mechanism. Background technique [0002] In a film-forming apparatus that forms a film on the surface of a substrate by sputtering, when film-forming processes are performed individually using a plurality of targets made of different materials, in order to suppress contamination by particles flying out from other targets The surfaces of the unused targets need to be equipped with a shutter mechanism that individually covers each of the plurality of targets. A shutter mechanism for covering the target in this way can be used for pre-sputtering. This pre-sputtering is a step for removing dirt adhering to the surface of the target, and is performed before film formation using the target. The pre-sputtering is performed by applying a voltage to the target in a s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/54
CPCC23C14/3407H01J37/3447C23C14/564H01J37/3414
Inventor 大庭尚树
Owner KOBE STEEL LTD