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Cutting device, cutting method, and manufacturing method of display panel

A technology of cutting equipment and cutting method, which is applied in the direction of welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of reducing the life of the moving mechanism of the cutting equipment, affecting the cutting accuracy, etc.

Active Publication Date: 2021-03-16
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is to say, in the existing production method, the workbench needs to move back and forth frequently, which not only affects the production efficiency, but also affects the cutting accuracy.
Moreover, because the workbench moves back and forth frequently, it is easy to reduce the life of the kinematic mechanism of the cutting equipment

Method used

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  • Cutting device, cutting method, and manufacturing method of display panel
  • Cutting device, cutting method, and manufacturing method of display panel

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Embodiment Construction

[0019] In order to make the above-mentioned and other objects, features, and advantages of the present disclosure more clearly understood, the preferred embodiments of the present disclosure will be exemplified below, and will be described in detail in conjunction with the accompanying drawings.

[0020] Please refer to figure 1 , which shows a schematic diagram of a cutting apparatus 1 according to a preferred embodiment of the present disclosure. The cutting apparatus 1 is for cutting a substrate 2 of a display panel, especially a substrate on which a thin film transistor array is formed. It should be noted that alignment marks 20 and cutting lines 21 are formed on the substrate 2 to be cut, wherein the alignment marks 20 are physically existing lines. However, alternatively, the cutting line 21 may be an actual line or a virtual line, which is not limited thereto. In addition, the alignment mark 20 of the substrate 2 is separated from the cutting line 21 by a distance 3 i...

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PUM

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Abstract

The invention provides a cutting device, a cutting method, and a manufacturing method of a display panel. The cutting device comprises a bearing platform, an alignment system, a moving device and a laser head, wherein the bearing platform comprises a first surface and a second surface opposite to the first surface; the first surface is used for laying a substrate; the substrate comprises an alignment mark and a cutting line; the alignment mark and the cutting line of the substrate are separated by a distance in a first direction; the alignment system is arranged on one side, opposite the bearing platform, of the first surface and used for aligning with the alignment mark of the substrate; the moving device is connected with the aligning system and used for driving the aligning system to horizontally move relative to the bearing platform along the first direction; and the laser head is arranged on one side, opposite to the bearing platform, of the second face and used for cutting the substrate along the cutting line of the substrate.

Description

technical field [0001] The present disclosure relates to the field of display devices, and in particular, to a cutting apparatus for a display panel, a cutting method thereof, and a manufacturing method of the display panel. Background technique [0002] In the production process of an organic light-emitting diode (OLED) display panel, a laser cutting device needs to be used to cut the substrate of the display panel into a size that meets the requirements of the vapor deposition machine according to the alignment marks. In order to realize the above process, the alignment mark of the substrate must be read by the alignment imaging system, and then the substrate is cut into the required size by the laser head along the cutting line. [0003] With the gradual increase in the size of the OLED substrate, limited by the process capability of the thin film transistor array, it is impossible to make an alignment mark at the position of the cutting line, resulting in a certain dista...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/70
CPCB23K26/38B23K26/702
Inventor 周文涛
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD