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Apparatus and methods for controlled electrochemical surface modification

An electrochemical and surface structure technology, applied in the direction of chemical instruments and methods, electrochemical variables of materials, measuring devices, etc., can solve the problem of lack of selectivity

Active Publication Date: 2019-07-30
MFG SYST LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, current methods lack selectivity in attachment sites

Method used

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  • Apparatus and methods for controlled electrochemical surface modification
  • Apparatus and methods for controlled electrochemical surface modification
  • Apparatus and methods for controlled electrochemical surface modification

Examples

Experimental program
Comparison scheme
Effect test

example 7

[0314] Examples include:

[0315] Selective attachment using redox-mediated reactions

[0316] · Selective metal deposition

[0317] Selective desorption of self-assembled monolayers (applicable to non-specific binding of matrix proteins)

[0318] 2. Enhance the electrocatalytic process by reducing the thermodynamic energy cost and increasing the kinetic conversion.

[0319] The invention is particularly suitable for the fields of biosensor, electrochemical sensing, optical sensing, electrocatalysis or selective deposition of materials. Other applications can also include displays, signs, active surfaces and other applications that require functionality to be attached to the surface.

[0320] image 3 Individual (A and B) and overlaid (C) cyclic voltammograms of flat (A) and pointed (B) electrodes showing ferrocyanide (0.1 mol) in phosphate buffer relative to an Ag / AgCl reference electrode . The cyclic voltammetry traces shown take into account the relative area of ​​the...

example 5

[0407] Example 5 shows deposition of a first bonding layer (SAM) on an electrode array, followed by selective removal of the bonding layer from the functional surface at or around the vertices of the array surface structure, followed by deposition of a different bonding layer (SAM) at or around the vertices. ) example.

[0408] Removal of the binding layer from the upper part of the surface structure enables the selective attachment of the binding layer comprising the function at or around the apex of the surface structure. This can be used for attachment of binding agents and / or detection moieties, eg for use as a biosensor, for testing a solution of a target analyte.

[0409] The binding layer on the functional surface can be removed by electrochemically modifying the active species in a solution in which the active species is solvated in a charged or ionic species such as selected from the group consisting of buffers, salt species and NaCl. The active material preferably a...

example 4

[0447] Example 4 describes an experiment of selectively depositing particles-platinum on a surface structure by focusing the charge density (voltage or current) on the upper part of the surface structure. Figure 9 and 10 Scanning electron microscope (SEM) micrographs are shown in which platinum particles are selectively attached to the upper part (at or around the apex) of the cone surface structures.

[0448] Preferably, the charged particles comprise metal ions or conductive polymers (PPY, PA, PA).

[0449] Preferably, the metal ions include platinum, gold, palladium, iron, iridium, silver in ionic form,

[0450] Preferably, the ionic form is an oxidized form of the metal ion.

[0451] Preferably, the ionic form is selected from transition metals such as Ni 2+ 、Cu 2+ 、Pt 2+ , Pd 2+ , Fe 2+ 、Ir 2+ , Sc, Ti, Vn, Cr, Mn, Co, Zn, Au, Tg, Yt, Mb.

[0452] Preferably, the density of charged particles attached to the functional surface is greater than the density of charg...

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Abstract

The invention is directed to a method of focussing charge density (voltage or current) at a functional surface on an electrode array, the method comprising the steps of: a. providing an electrode array comprising: i. a support substrate; ii. at least one surface structure protruding from an upper surface of the support substrate wherein the surface structure includes an electrode layer; iii. a functional surface on the electrode layer, wherein the functional surface is on an upper portion of the at least one surface structure and wherein the functional surface is adapted to contact an active species in a conductive solution; b. exposing the surface structure to the conductive solution comprising an active species, in which a counter electrode is positioned; and c. establishing a current orvoltage between the functional surface on the electrode layer and the counter electrode such that the charge density is focussed at the functional surface on the electrode layer. The invention is also directed to electrode arrays that may be used in that method.

Description

technical field [0001] The present invention involves the use of focused charge density (voltage and / or current) to control the location or modification of active species on electrode surfaces. More specifically, although not exclusively, the invention relates to attaching or removing species at the tips of surface structures for electrochemical sensing, catalysis, deposition or modification. Background technique [0002] Localization of active species, such as sensing agents or catalysts, on electrodes is important in many applications. Examples include sensors, catalysts for fuel cells, and the production or storage of hydrogen and oxygen. [0003] Nanomaterials and nanotechnology have attracted great interest in recent years because interesting properties at the nanoscale differ from their macroscale counterparts. The unusual electronic behavior exhibited by these materials can be exploited in new technologies for advanced materials and device miniaturization, opening u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02H01M4/02G01N27/30B01J37/34C25B3/25
CPCC25D7/00G01N27/30G01N27/27G01N27/3275G01N27/3278C25D5/02Y02E60/50C25D3/50G01N27/327
Inventor A·侯赛尼A·帕特里奇
Owner MFG SYST LTD