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Backside silver paste for mobile phone resistor and preparation method thereof

A resistor and backside technology, which is applied in the field of silver paste on the backside of mobile phone resistors and its preparation, can solve problems such as poor electroplatability and unstable printing performance, and achieve the effect of solving process performance

Inactive Publication Date: 2019-08-06
SHANGHAI BAOYIN ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, most of the back silver paste used by domestic mobile phone manufacturers is imported silver paste. European, American and Japanese companies have relatively mature product technology and relatively high prices; a small part uses domestic silver paste, which mainly has the following problems: unstable printing performance, Poor electroplatability, etc.

Method used

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  • Backside silver paste for mobile phone resistor and preparation method thereof
  • Backside silver paste for mobile phone resistor and preparation method thereof
  • Backside silver paste for mobile phone resistor and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0031] In this embodiment, a back silver paste for mobile phone resistors, the back silver paste includes the following components and weight percentage content: 35% of metal silver powder, 3% of glass powder, 4% of metal oxide, 2% of plasticizer, organic Carrier 40%, and organic solvent 16%.

[0032] Among them, the metallic silver powder is spherical silver powder with a particle size of 1.0 μm and a tap density of 2.2 g / ml. The glass powder is lead-free glass powder with a thermal expansion coefficient of 110×10 -7 / °C, the sintering temperature is 550°C, the glass powder includes the following components and weight percentages: Bi 2 o 3 81%, ZnO 6.5%, B 2 o 3 6.5%, SiO 2 2%, Na 2 O 3%, TiO 2 0.5% and Al 2 o 3 0.5%.

[0033] The metal oxide is zirconia, analytically pure grade.

[0034] The plasticizer is tributyl citrate.

[0035] The organic carrier is made by mixing ethyl cellulose and terpineol. The specific preparation method is: according to the mass ...

Embodiment 2

[0044] In this embodiment, a back silver paste for mobile phone resistance, the back silver paste includes the following components and weight percentage content: 45% of metal silver powder, 4% of glass powder, 5% of metal oxide, 3% of plasticizer, organic Carrier 29%, and organic solvent 14%.

[0045] Wherein, the metallic silver powder is spherical silver powder with a particle size of 1.2 μm and a tap density of 2.5 g / ml. The glass powder is lead-free glass powder with a thermal expansion coefficient of 115×10 -7 / °C, the sintering temperature is 700°C, the glass powder includes the following components and weight percentages: Bi 2 o 3 85%, ZnO 5%, B 2 o 3 3%, SiO 2 1%, Na 2 O1%, TiO 2 3% and Al 2 o 3 2%.

[0046] The metal oxide is iron oxide, analytically pure grade.

[0047] The plasticizer is dioctyl phthalate.

[0048]The organic carrier is made by mixing nitrocellulose and tripropylene glycol monomethyl ether. The specific preparation method is: accor...

Embodiment 3

[0057] In this embodiment, a back silver paste for mobile phone resistance, the back silver paste includes the following components and weight percentage content: 55% of metal silver powder, 5% of glass powder, 4% of metal oxide, 2% of plasticizer, organic Carrier 24%, and organic solvent 10%.

[0058] Wherein, the metallic silver powder is spherical silver powder with a particle size of 1.5 μm and a tap density of 3.0 g / ml. The glass powder is lead-free glass powder with a thermal expansion coefficient of 110×10 -7 / °C, the sintering temperature is 550°C, the glass powder includes the following components and weight percentages: Bi 2 o 3 75%, ZnO 6%, B 2 o 3 10%, SiO 2 5%, Na 2 O3%, TiO 2 0.5% and Al 2 o 3 0.5%.

[0059] The metal oxide is titanium oxide, analytically pure grade.

[0060] The plasticizer is trioctyl citrate.

[0061] The organic carrier is composed of ethyl cellulose, nitrocellulose, diethylene glycol butyl ether and dipropylene glycol monome...

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Abstract

The invention relates to backside silver paste for a mobile phone resistor and a preparation method thereof. The silver paste comprises the following components, in percentage by weight, 35-55% of metal silver powder, 2-6% of glass frit, 3-7% of metal oxide, 1-3% of plasticizer, 20-40% of organic carrier and 10-20% of organic solvent. The preparation method comprises the steps of mixing the organic carrier and the organic solvent uniformly to form a uniform colloidal solution; successively adding other components, mixing the components by a mixer, grinding the components by a three-roll grinder so as to obtain the backside silver paste for the mobile phone resistor. The backside silver paste for the mobile phone resistor prepared by the method solves the technical problems of printing property, adhesion, electroplatability and the like, the technical indexes of a product all meet or exceed the level of similar foreign products, and the raw materials used can meet the domestic and oversea environmental protection technical requirements.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a back silver paste for mobile phone resistors and a preparation method thereof. Background technique [0002] With the continuous development of my country's economy, Chinese mobile phone manufacturers have achieved rapid development in the world in recent years, and the production and sales of mobile phones have also increased year by year. At the same time, the demand for silver paste for mobile phone resistors is also increasing, and the quality requirements are getting higher and higher. [0003] With the advent of the era of smart phones, small-sized chip resistors in mobile phones are basically essential electronic components. SMD resistors replace traditional capacitors with smaller volume and better characteristics, which is in line with the more sophisticated and functional needs of the mobile phone industry. Chip resistors use aluminum oxide ...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 朱庆明江海涵何利娜王德龙
Owner SHANGHAI BAOYIN ELECTRONICS MATERIALS CO LTD
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