Novel DBC board and preparation method
A new type of copper plate technology, used in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as chipping, ceramic material chipping, power module failure, etc., and achieve breakthroughs in adhesion and elasticity, thermal capacity Improved, high power output effect
Pending Publication Date: 2019-08-06
北京易威芯能科技有限公司
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Problems solved by technology
In the DBC board preparation process, ceramic materials are often at risk of fragmentation because they are relatively hard and brittle; during the operation of power devices, because they have to withstand continuous high-temperature and low-temperature cycle work, the difference in thermal expansion rate will also lead to ceramic material fragmentation. cracks, resulting in failure of the power module
Method used
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[0039] In order to further understand the structure, features and other purposes of the present invention, the attached preferred embodiments are now described in detail with accompanying drawings as follows. The embodiments described in the accompanying drawings are only used to illustrate the technical solutions of the present invention and are not limiting this invention.
[0040] First, if figure 1 as shown, figure 1 It is a structural schematic diagram of a new type of DBC board of the present invention; the DBC board is mainly divided into a surface copper layer, an intermediate resin material heat conducting insulation layer, and a bottom copper layer. This three-layer main structure has the following characteristics:
[0041] 1) The surface copper layer is thick copper with a thickness of 0.5mm-5mm, and the thickness of the surface copper foil can be increased by about 10 times compared with the existing DBC with a thickness of about 0.3mm. The substantial increase ...
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Abstract
The invention provides a novel DBC board and a preparation method. The DBC board comprises a surface circuit, an electrical isolation layer, surface copper layer modules, a middle resin material thermally conductive insulating layer and a bottom copper layer. The surface circuit is located on the upper surfaces of the surface copper layer modules, and is formed by laser etching of surface copper.The electrical isolation layer is located between the surface copper layer modules and is used for electrical isolation. The surface copper layer modules are fixedly connected to the upper surface ofthe middle resin material thermally conductive insulating layer. The middle resin material thermally conductive insulating layer is fixedly connected to the upper surface of the bottom copper layer. The DBC board of the invention adopts a thick Cu layer and an ultra-thin insulating material layer, which can greatly improve the heat dissipation efficiency of the power module, improve the heat capacity of the power module and reduce the package volume of the power device.
Description
technical field [0001] The invention relates to the field of power device packaging, in particular to a novel DBC board and a preparation method. Background technique [0002] DBC board is also called direct copper clad board, which is an essential part of power module packaging in the field of power electronics. DBC is a three-layer structure of copper (Cu)-ceramic material-copper, which plays three key functions in the power module, such as circuit layout, heat conduction, and insulation. The intermediate layer ceramic material of DBC generally adopts various hard materials with high thermal conductivity such as Al2O3 and AlN. Generally, it is prepared by sintering, electroplating and other processes, and then cut into the required size by laser. [0003] In the power module, the Cu layer on the surface of the DBC is directly connected to the chip, which not only plays the role of forming a circuit, but also plays the role of direct heat dissipation. Therefore, there ar...
Claims
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IPC IPC(8): H01L23/498H01L23/373H01L23/367H01L21/48
CPCH01L23/49838H01L23/49866H01L23/49894H01L23/3672H01L23/3736H01L23/3737H01L21/4821H01L21/4882
Inventor 王学华
Owner 北京易威芯能科技有限公司