Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer Vacuum Adsorption Device

A technology of vacuum adsorption and chip application in the direction of spraying devices, devices for coating liquid on the surface, coatings, etc., which can solve the problems of poor stability and poor chip spraying effect, and achieve the effect of increasing the contact rate

Active Publication Date: 2021-09-07
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a vacuum adsorption device to solve the technical problems of poor stability of vacuum adsorption device for wafer adsorption and poor wafer spraying effect in the prior art to a certain extent

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer Vacuum Adsorption Device
  • Wafer Vacuum Adsorption Device
  • Wafer Vacuum Adsorption Device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them.

[0030] The components of the embodiments of the invention generally described and shown in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention.

[0031] Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] In the description of the present invention, it should be noted that the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of semiconductor preparation, in particular to a wafer vacuum adsorption device. The wafer vacuum adsorption device includes an upper plate body and a lower plate body, and the upper plate body and the lower plate body both include a first end surface and a second end surface; a plurality of connected strip-shaped grooves are opened on the second end surface of the upper plate body, An adsorption through-hole is provided above each strip-shaped groove, one end of the adsorption through-hole communicates with the strip-shaped groove, and the other end of the adsorption through-hole runs through the first end surface of the upper plate; the adsorption through-hole and the strip-shaped groove Form gas channels. The upper disc body and the lower disc body are sealed and connected, and the first end surface of the upper disc body is in contact with the wafer for absorbing the wafer; the lower disc body is provided with a communication hole, which is connected with the vacuum generator, and the vacuum generator can pass through The communication hole extracts the gas in the gas channel, so that a negative pressure is formed in the gas channel, and the wafer is adsorbed on the first end surface of the upper plate.

Description

technical field [0001] The invention relates to the technical field of semiconductor preparation, in particular to a wafer vacuum adsorption device. Background technique [0002] The spray coating machine is suitable for uniform coating of photoresist on substrates with high ruggedness, which can effectively meet the requirements of TSV, MEMS and other manufacturing processes; when the spray coating machine is working, the wafer must be completely adsorbed on the vacuum chuck. Generally, it is also necessary to heat-bake the wafer being sprayed; in the existing vacuum chucks in the market, there are generally multiple concentric annular grooves on the end face of the wafer contact to realize the vacuum adsorption of the wafer. The vacuum effect of the groove often causes deformation or even rupture of the wafer; at the same time, the structure of the annular groove also reduces the contact rate between the wafer and the vacuum chuck, which easily causes uneven heating of the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683B05B13/02B05D3/02
CPCB05B13/0285B05D3/0254
Inventor 贾月明周占福周立庆艾博董晴晴许向阳
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC