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A kind of preparation method of double-sided copper-clad LCD board

A technology of double-sided copper cladding and pressing, applied in chemical instruments and methods, lamination, lamination devices, etc., can solve problems such as low peel strength, and achieve the effects of high peel strength, high bonding force and good structural stability

Active Publication Date: 2022-02-22
SHENZHEN SUNWAY COMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The disadvantage of current LCP-based FCCL is the low peel strength

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0012] A preparation method for a double-sided copper-clad LCP board, comprising the steps of,

[0013] S1, put the stacked stack on the lower pressing plate of the pressing equipment;

[0014] S2, using the pressing equipment to sequentially pre-press, pressurize and maintain the pressure on the stack to obtain a semi-finished product;

[0015] S3, performing air-cooling treatment on the semi-finished product to obtain a finished product.

[0016] It can be seen from the above description that the beneficial effect of the present invention is that compared with the double-sided copper-clad LCP board prepared by wire bonding in the prior art, the double-sided copper-clad LCP board prepared by surface bonding has higher bonding force , Better solder resistance, higher peel strength, better structural stability; can improve the appearance and flatness of LCP board molding.

[0017] Further, step S01 is included before step S1, stacking the first protective film, the first copp...

Embodiment 1

[0027] Embodiment 1 of the present invention is: a method for preparing a double-sided copper-clad LCP board, comprising the following steps,

[0028] S00, perform preheating treatment on the upper pressing plate and / or the lower pressing plate of the pressing equipment, after the preheating treatment, the temperature of the upper pressing plate and / or the lower pressing plate is ±25°C of the melting point of the double-sided copper-clad LCP board. The surfaces of the upper pressing plate and the lower pressing plate which are close to each other are planes respectively.

[0029] S01, stacking the first protective film, the first copper foil, the base film, the second copper foil and the second protective film sequentially from bottom to top to obtain a stack. In this embodiment, the substrate film is an LCP film, and in other embodiments, the substrate film can be a thermoplastic film, such as polytetrafluoroethylene film and polyethylene terephthalate film.

[0030] S1, put...

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PUM

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Abstract

The invention discloses a method for preparing a double-sided copper-clad LCP board, comprising the following steps: S1, laying the stacked piles on the lower pressing plate of the pressing equipment; S2, using the pressing equipment to The stacks are pre-pressed, pressurized and pressure-maintained sequentially to obtain a semi-finished product; S3, performing air-cooling treatment on the semi-finished product to obtain a finished product. Compared with the double-sided copper-clad LCP board prepared by wire lamination in the prior art, the double-sided copper-clad LCP board prepared by surface lamination has higher bonding force, better solder resistance, and higher peel strength. Better structural stability; can improve the appearance and flatness of LCP board molding.

Description

technical field [0001] The invention relates to the technical field of LCP circuit boards, in particular to a preparation method of a double-sided copper-clad LCP board. Background technique [0002] LCP is a new type of thermoplastic organic material, which can realize high-frequency and high-speed transmission under the premise of ensuring high reliability. LCP FCCL (LCP double-sided copper clad laminate) has excellent performance characteristics: (1) It can maintain a constant dielectric constant almost in the entire radio frequency range up to 110GHz, with good stability; (2) The loss tangent is very small, only 0.002 , Even at 110GHz, it only increases to 0.0045, which is very suitable for millimeter wave applications; (3) The thermal expansion characteristics are very small, which can be used as an ideal high-frequency packaging material. At present, LCP FCCL is mainly used in high-frequency circuit substrates, COF substrates, multilayer boards, IC packaging, high-fre...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10
CPCB32B37/10
Inventor 王凤刘飞华宋喆虞成城刘开煌苏聪
Owner SHENZHEN SUNWAY COMM