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Grinding equipment, detection device, and grinding method of semiconductor substrate

A detection device, grinding method technology, applied in the direction of grinding device, measuring device, grinding/polishing equipment, etc., can solve unsatisfactory problems

Active Publication Date: 2021-06-11
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although existing semiconductor manufacturing machines (including wafer grinding systems) have been able to meet the above general purpose, these semiconductor manufacturing machines and filtration methods are still not satisfactory in all aspects

Method used

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  • Grinding equipment, detection device, and grinding method of semiconductor substrate
  • Grinding equipment, detection device, and grinding method of semiconductor substrate
  • Grinding equipment, detection device, and grinding method of semiconductor substrate

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Embodiment Construction

[0061] The implementation modes or examples disclosed below are used to illustrate or complete various technical features of the present invention, and the specific embodiments of the described elements and configurations are used to simplify the description of the present invention, so as to make the disclosure more thorough and complete, so as to The scope of this disclosure is fully conveyed to those skilled in the art. Of course, the present disclosure can also be implemented in many different forms without being limited to the embodiments described below.

[0062] Spatially relative terms such as "below", "below", "lower", "above", "higher" and similar terms are used in the text below to facilitate the description of an The relationship between an element or feature and another element or feature(s). These spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. Fo...

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Abstract

The disclosure provides a grinding equipment, a detection device and a grinding method of a semiconductor substrate. The grinding equipment includes a rotating platform, a grinding pad, a grinding slurry provider and at least one detection device. The polishing pad is fixedly arranged on the rotating platform, and the polishing pad is configured to be rotated by the rotating platform. The slurry provider is configured to provide a slurry on the polishing pad. At least one detection device is arranged in the grinding pad, and the detection device is configured to detect the composition and the corresponding concentration of the grinding slurry.

Description

technical field [0001] The embodiments of the present invention relate to a semiconductor manufacturing technology, in particular to a grinding system and a grinding method for monitoring the composition of the grinding slurry during the grinding process. Background technique [0002] In recent years, semiconductor integrated circuits have experienced exponential growth. Technological advances in integrated circuit materials and design have resulted in generations of integrated circuits, with each generation having smaller and more complex circuits than the previous generation. During the development of integrated circuits, functional density (ie, the number of interconnect devices per chip area) is often will increase. Generally speaking, this size reduction process can provide the benefits of increasing production efficiency and reducing manufacturing costs. However, this size reduction process also increases the complexity of manufacturing and producing integrated circu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/10B24B37/04B24B37/30B24B37/34B24B57/02H01L21/306G01N27/00
CPCB24B37/042B24B37/105B24B37/30B24B37/34B24B57/02G01N27/00H01L21/30625
Inventor 蔡晴翔许加融陈科维黄惠琪
Owner TAIWAN SEMICON MFG CO LTD