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Packaging substrate, semiconductor device and lamp source

A technology for packaging substrates and semiconductors, which is applied to semiconductor devices, electric solid devices, electrical components, etc., can solve the problems of poor light mixing effect and achieve good light mixing effect and flexible arrangement

Pending Publication Date: 2019-08-23
SHENZHEN LIGHTSPOT ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of this, the purpose of this application is to provide a packaging substrate, semiconductor device and light source to improve the problem of poor light mixing effect caused by existing packaging methods

Method used

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  • Packaging substrate, semiconductor device and lamp source
  • Packaging substrate, semiconductor device and lamp source
  • Packaging substrate, semiconductor device and lamp source

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Experimental program
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Embodiment Construction

[0036] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

[0037] It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

[0038]In the description of this application, it should be noted that the orientation or positional relationship indicated by the terms "inside", "top", "bottom" and so on are based on the orientation or positional relationship shown in the accompanying drawings, or the customary The orientation or positional relationship of placement is only for the convenience of describing the application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific...

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PUM

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Abstract

The invention discloses a packaging substrate, a semiconductor device and a lamp source, and belongs to the technical field of photoelectric semiconductors. The packaging substrate comprises a substrate body, a circuit structure and a pad structure. The circuit structure is arranged on the first surface of the substrate body and used for connecting a light emitting chip. The pad structure is arranged on the second surface of the substrate body. The pad structure comprises a pad pair corresponding to the circuit structure. A first distance is reserved between the two pads in the pad pair. A second distance is reserved between the pad near the edge of the second surface and the edge. The circuit structure and each pad are electrically connected through the corresponding conductive member arranged on the substrate body. The space for wiring is reserved on the second surface of the packaging substrate so that there is no need to reserve too much wiring space on the PCB when the light emitting chip is packaged by the packaging substrate to form the device and multiple devices are arranged and combined, and thus all the devices can be arranged on the PCB in an adjacent way and the arrangement of high power density can be more easily realized.

Description

technical field [0001] The application belongs to the technical field of semiconductors, and in particular relates to a packaging substrate, a semiconductor device and a light source. Background technique [0002] With the improvement of luminous efficiency and the decline of manufacturing cost, semiconductor light sources, especially semiconductor light sources (such as LED light sources) involving multiple color temperatures (two or more) have been widely used in changing scenes or changing with time. For office, study, shopping malls, household, exhibition and other lighting fields for color temperature and spectrum adjustment. [0003] At present, there are three main ways to realize the LED package structure of multi-color temperature: [0004] The first one, COB (Chip On Board, chip on board), mainly separates different color temperatures through dam glue, and divides them into multiple areas (larger areas). This method is more troublesome to produce, and the LED chip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52H01L33/62H01L33/64H01L25/075
CPCH01L33/48H01L33/52H01L33/62H01L33/64H01L25/0753
Inventor 王际翔
Owner SHENZHEN LIGHTSPOT ELECTRONICS TECH CO LTD