Housing assembly, manufacturing method thereof, and electronic device
A shell assembly and metal layer technology, which is used in electrical equipment structural parts, electrical components, cooling/ventilation/heating renovation, etc. problem, to avoid excessive concentration and increase the heat dissipation and heat transfer area.
Active Publication Date: 2020-11-27
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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- Description
- Claims
- Application Information
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Problems solved by technology
Some current electronic devices will automatically take some measures to reduce power consumption after the temperature rises, which leads to a decrease in the operating efficiency of the electronic device, causing the electronic device to become stuck; at the same time, the user will feel hot when holding the electronic device
Method used
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[0019] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.
[0020] With the rapid development of electronic devices (such as mobile terminals), the power consumption of the electronic devices is gradually increasing, and accordingly, the heat generated by the electronic devices during work is also relatively large. Taking the power supply as an example, the existing housing assembly is fixed on the middle frame of the power supply by glue. During the heat dissipation process, the heat generated by the power supply is transferred to the housing assemb...
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The embodiment of the invention provides a shell assembly, a preparation method of the shell assembly and electronic equipment. The shell assembly can comprise a middle frame, a first metal layer, a second metal layer and a heat conduction medium; the middle plate comprises a mounting surface; a groove is formed in the mounting surface; the middle plate further comprises a bottom wall and a side wall positioned in the groove; the first metal layer and the bottom wall are subjected to injection molding and are laid on the bottom wall; the second metal layer and the first metal layer are oppositely arranged; the end part of the second metal layer and the side wall are subjected to injection molding; and a medium cavity is defined by the middle plate, the first metal layer and the second metal layer. The heat conduction medium is arranged in the medium cavity. The first metal layer or the second metal layer is embedded into the middle plate, so that the thickness of the shell assembly orthe electronic equipment cannot be additionally increased. During use, the first metal layer and a heating element are correspondingly attached to conduct heat, uniform heating is carried out on the whole shell assembly through the heat conduction medium, and the heat is prevented from being excessively concentrated in the local place of the electronic equipment.
Description
technical field [0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to a shell assembly, a preparation method thereof, and electronic equipment. Background technique [0002] The power supply of electronic equipment or other electronic devices will generate a lot of heat during operation, which will increase the overall temperature of the electronic equipment. When the temperature rises sharply, there is a risk of spontaneous combustion. Some current electronic devices will automatically take some measures to reduce power consumption after the temperature rises, which leads to a decrease in the operating efficiency of the electronic device, causing the electronic device to become stuck; at the same time, the user will feel hot when holding the electronic device. Contents of the invention [0003] The purpose of the present application is to provide a shell assembly, its preparation method and electron...
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IPC IPC(8): H05K7/20
CPCH05K7/20336H05K7/20472
Inventor 贾玉虎
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD