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Preparation method of array substrate, array substrate and display panel

A technology of array substrate and colloidal layer, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of small pixel size and difficult embossing implementation

Active Publication Date: 2019-09-17
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Adopting a quasi-periodic wrinkled structure can effectively improve the light extraction of the substrate and waveguide mode. Therefore, in the prior art, template imprinting is often used to prepare wrinkled or periodic concave-convex structures, and most of the existing OLED display devices are AMOLED top-emitting devices. There is a fine TFT backplane structure at the bottom, and the pixel size is small, which is difficult to realize by embossing

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  • Preparation method of array substrate, array substrate and display panel
  • Preparation method of array substrate, array substrate and display panel
  • Preparation method of array substrate, array substrate and display panel

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] Please refer to figure 1 , figure 2 , image 3 and Figure 4 , the present invention provides a method for preparing an array substrate, comprising:

[0032] Prepare a thin film transistor device layer 2 on the substrate 1;

[0033] Prepare a pixel planar layer 3 on the side of the thin film transistor device layer 2 away from the substrate 1;

[0034] On the side of the pixel flat layer 3 away from the substrate 1, a layer of colloidal layer 4 m...

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Abstract

The invention relates to the technical field of display equipment and discloses a preparation method of an array substrate, the array substrate and a display panel. The preparation method comprises the step of successively preparing a thin film transistor device layer, a pixel flat layer, a colloid layer with a fluctuating structure and an organic light-emitting device layer with the same fluctuating structure as the colloid layer on a substrate, wherein the organic light-emitting device layer comprises an anode, an organic light-emitting layer and a cathode which are sequentially formed on the side, away from the substrate, of the colloid layer. According to the invention, the colloid layer with the fluctuating structure and the organic light-emitting device layer with the same fluctuating structure as the colloid layer are prepared; the preparation method is simple and convenient; and the light extraction efficiency can be better improved.

Description

technical field [0001] The present invention relates to the technical field of display devices, in particular to a method for preparing an array substrate, an array substrate, and a display panel. Background technique [0002] The principle of light emission of organic electroluminescent (OLED) devices is as follows: electrons and holes are respectively injected into the organic functional layer from the cathode and anode of the device, recombine in the "light-emitting layer" and convert electrical energy into light energy in the form of luminous radiation and emit it to the device outside. As a self-luminous device, OLED is very attractive in the field of outdoor display devices such as smart phones and vehicles due to its excellent electroluminescence characteristics. [0003] Generally speaking, OLED devices are limited by high refractive index components, and the light extraction efficiency is only about 20%, and about 80% of the light is confined inside the device and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32
CPCH10K59/124H10K59/1213H10K59/1201
Inventor 李鑫樊星温向敏
Owner BOE TECH GRP CO LTD