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Film layer structure and preparation method thereof, housing mechanism and electronic equipment

A film-layer structure and film-layer technology, which can be applied in the direction of electrical equipment shell/cabinet/drawer, branch equipment, decorative structure, etc., can solve the problem of single pattern effect and so on.

Active Publication Date: 2022-04-12
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the pattern effect obtained in this way is single

Method used

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  • Film layer structure and preparation method thereof, housing mechanism and electronic equipment
  • Film layer structure and preparation method thereof, housing mechanism and electronic equipment
  • Film layer structure and preparation method thereof, housing mechanism and electronic equipment

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Experimental program
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preparation example Construction

[0173] see again Figure 1-11 , In addition, the method for preparing the film layer structure 20 in one embodiment can prepare the film layer structure 20 with color and bright pattern effects. Specifically, the preparation method of the film layer structure 20 includes the following steps S110-S120:

[0174] S110 , providing a first film layer assembly 100 . The first film layer assembly 100 includes a first film material 110 and a texture layer 120 that are sequentially stacked.

[0175] It should be noted that, for the structure of the first membrane layer assembly 100 , please refer to the description above, and details will not be repeated here.

[0176]In one embodiment, the method for preparing the film layer structure 20 includes the step of preparing the first film layer assembly 100 : forming the texture layer 120 on the first film material 110 by using a UV transfer printing process to obtain the first film layer assembly 100 . Further, the texture on the special...

Embodiment 1

[0250] The structure of the housing mechanism of this embodiment is as Figure 1-11 As shown, its preparation process is as follows:

[0251] (1) The first membrane material is HP12 explosion-proof membrane (purchased from SKC Company). The first film material includes a functional layer and an adhesive layer that are laminated. The material of the functional layer is PET. The thickness of the functional layer was 50 μm. The material of the adhesive layer is OCA. The thickness of the adhesive layer was 25 μm. A texture layer is formed on the side of the functional layer away from the adhesive layer by a UV transfer process. A1 is 90°. D1 is 8 μm. H1 is 9 μm. D2 is 8 μm. H2 is 6 μm. A3 is 30°. D3 is 8 μm. H3 is 5.5 μm. The energy of UV transfer printing is 800mj / cm 2 .

[0252] (2) An adhesion layer, a first refraction layer, a spacer layer and a second refraction layer are sequentially stacked on the texture layer by using an electron evaporation process to obta...

Embodiment 2

[0259] The structure of the housing mechanism of this embodiment is substantially the same as that of Embodiment 1, except that the dimensions of the housing mechanism are different. The preparation process of the shell mechanism of this embodiment is as follows:

[0260] (1) The first film material is PET explosion-proof film (purchased from SKC Company). The first film material includes a functional layer and an adhesive layer that are laminated. The material of the functional layer is PET. The thickness of the functional layer was 48 μm. The material of the adhesive layer is OCA. The thickness of the adhesive layer was 20 μm. A texture layer is formed on the side of the functional layer away from the adhesive layer by a UV transfer process. A1 is 85°. D1 is 6 μm. H1 is 8 μm. D2 is 6 μm. H2 is 5 μm. A3 is 25°. D3 is 6 μm. H3 is 5 μm. The energy of UV transfer printing is 500mj / cm 2 .

[0261] (2) An adhesion layer, a first refraction layer, a spacer layer and ...

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Abstract

The invention relates to a film layer structure and a preparation method thereof, a casing mechanism and electronic equipment. The film layer structure includes a first film layer assembly and a second film layer assembly, the first film layer assembly includes a first film material and a texture layer that are stacked in sequence; the second film layer assembly includes a second film material and is arranged on the second For the ribbon unit on the film material, the second film layer assembly is stacked on the first film layer assembly, the ribbon unit is arranged close to the first film material, and the orthographic projection of the ribbon unit on the texture layer falls on the texture layer. The pattern styles of the above-mentioned film layer structure are abundant.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a film layer structure and a preparation method thereof, a casing mechanism and electronic equipment. Background technique [0002] With the development of product diversity of electronic equipment, users put forward higher requirements on the appearance of electronic equipment. How to improve the appearance of electronic equipment is a research direction that the industry generally pays attention to. Some studies have used the offset printing process to transfer the pattern to the electronic device, so that the electronic device can present the pattern. However, the pattern effect obtained in this way is single. Contents of the invention [0003] Based on this, it is necessary to provide a film layer structure with rich pattern effects. [0004] In addition, the invention also provides a preparation method of the film layer structure, a casing mechanism and ele...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B33/00
CPCH05K5/0243B44C5/04B44C3/02B44C1/105B44F1/08H04M1/0283B32B7/12B44C1/16
Inventor 邱惊龙
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD