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Electronic equipment heat dissipation method and heat radiator

A technology of electronic equipment and heat dissipation method, which is applied to the structural parts of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc. High thermal efficiency and significant effect

Active Publication Date: 2019-09-20
贵州永红换热冷却技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the heating power of electronic equipment is high, Figure 5 , Image 6 and Figure 7 The heat sink shown cannot meet the heat dissipation requirements of electronic equipment

Method used

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  • Electronic equipment heat dissipation method and heat radiator
  • Electronic equipment heat dissipation method and heat radiator
  • Electronic equipment heat dissipation method and heat radiator

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Experimental program
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Effect test

Embodiment Construction

[0032] The present invention will be further described below in conjunction with the accompanying drawings, but the claimed protection scope is not limited to the above.

[0033] Such as Figure 8-10 As shown, in a traditional radiator, only the heat is transferred from the hot fluid to the cold fluid between the two hot fluids, part of the heat passes through the metal plate (primary heat transfer path), and the heat of the hot fluid is transferred to the cold fluid. Through the metal plate and fins (secondary heat transfer path), the heat of the hot fluid is transferred to the cold fluid. The thinner fins provide heat transfer by increasing the heat transfer area. The thinner fins can only The heat is transferred at a close distance. The greater the distance from the metal plate, the lower the heat transfer efficiency of the fin.

[0034] In this embodiment, the radiator is mainly composed of four parts: side plate 1, metal plate 2, fin 3, and seal 4. Each part is assembled, wel...

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PUM

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Abstract

The invention discloses an electronic equipment heat dissipation method and a heat radiator. The heat radiator comprises at least two metal plates which are arranged in parallel in a spaced way. Fins are arranged between the adjacent metal plates. The outer sides of the metal plates arranged at the left and right ends are connected with side plates. The two outer end surfaces of the fins along a cooling medium flow direction are provided with sealing strips. The heat generated by the electronic equipment is transmitted to the cooling medium through three different paths of the sealing strips, the metal plates and the fins and the heat dissipation requirement of the electronic equipment can be met by the lightest structural weight, the heat transfer efficiency is high, different installation structures can be designed according to different installation requirements of the electronic equipment, the structural weight is low and the mechanical structure performance is good.

Description

Technical field [0001] The invention relates to the technical field of radiator design for electronic equipment, in particular to a new type of high-efficiency heat exchange heat dissipation method and radiator. Background technique [0002] Since the advent of silicon integrated circuits, the application of electronic equipment in military and civilian fields has greatly increased. As the heating power of electronic equipment becomes larger and smaller, the heating density rises sharply, and the temperature of electronic equipment rises rapidly, which causes more and more failures of electronic equipment, which affects the reliability of the system or equipment Especially huge, even causing catastrophic consequences, the heat dissipation of electronic equipment has become the key to the miniaturization of electronic equipment. Therefore, in order to meet the cooling needs of modern electronic equipment, it is particularly important to develop a new type of high-efficiency radia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20254
Inventor 崔巍王家喜李恺锋
Owner 贵州永红换热冷却技术有限公司