Method for dissipating heat from electronic equipment and radiator
A technology of electronic equipment and heat dissipation method, which is applied to the structural components of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc., can solve the problem that the radiator cannot meet the heat dissipation requirements of electronic equipment, and achieve good mechanical structure performance and structure Low weight, significant effect
Active Publication Date: 2020-08-28
贵州永红换热冷却技术有限公司
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Problems solved by technology
When the heating power of electronic equipment is high, Figure 5 , Image 6 and Figure 7 The heat sink shown cannot meet the heat dissipation requirements of electronic equipment
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[0032] The present invention will be further described below in conjunction with the accompanying drawings, but the claimed protection scope is not limited to the description.
[0033] Such as Figure 8-10 As shown, in the traditional heat sink, heat is only transferred from the hot fluid to the cold fluid between the two hot fluids, part of the heat passes through the metal plate (primary heat transfer path), and the heat of the hot fluid is transferred to the cold fluid, and part of the heat The heat of the hot fluid is transferred to the cold fluid through metal plates and fins (secondary heat transfer path). Thinner fins provide heat transfer by increasing the heat transfer area. Thinner fins can only The heat is transferred in a short distance, and the greater the distance from the metal plate, the lower the heat transfer efficiency of the fins.
[0034] In this embodiment, the radiator is mainly composed of four parts: side plate 1, metal plate 2, fin 3 and seal 4, and ...
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The invention discloses an electronic equipment heat dissipation method and a heat radiator. The heat radiator comprises at least two metal plates which are arranged in parallel in a spaced way. Fins are arranged between the adjacent metal plates. The outer sides of the metal plates arranged at the left and right ends are connected with side plates. The two outer end surfaces of the fins along a cooling medium flow direction are provided with sealing strips. The heat generated by the electronic equipment is transmitted to the cooling medium through three different paths of the sealing strips, the metal plates and the fins and the heat dissipation requirement of the electronic equipment can be met by the lightest structural weight, the heat transfer efficiency is high, different installation structures can be designed according to different installation requirements of the electronic equipment, the structural weight is low and the mechanical structure performance is good.
Description
technical field [0001] The invention relates to the technical field of heat sink design for electronic equipment, in particular to a novel high-efficiency heat exchange heat dissipation method and a heat sink. Background technique [0002] Since the advent of silicon integrated circuits, the application of electronic equipment in military and civilian fields has greatly increased. As the heating power of electronic equipment increases and the volume becomes smaller and smaller, the heating density rises sharply, and the temperature of electronic equipment rises rapidly, resulting in more and more failures of electronic equipment, which affects the reliability of the system or equipment. Especially huge, and even cause disastrous consequences, the heat dissipation problem of electronic equipment has become the key to the miniaturization of electronic equipment. Therefore, in order to meet the cooling needs of modern electronic equipment, it is particularly important to devel...
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IPC IPC(8): H05K7/20
CPCH05K7/20254
Inventor 崔巍王家喜李恺锋
Owner 贵州永红换热冷却技术有限公司