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Printed circuit board and manufacturing method thereof

A technology of printed circuit boards and printed silk screens, applied in the directions of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of low production efficiency, environmental pollution, low production automation, etc., to improve production efficiency, reduce Production cost, effect of simplified processing steps

Inactive Publication Date: 2019-09-24
惠州市超频三全周光智能照明科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] What the present invention needs to solve are the problems of low production automation, low production efficiency and serious environmental pollution in the prior art

Method used

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  • Printed circuit board and manufacturing method thereof
  • Printed circuit board and manufacturing method thereof

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Embodiment Construction

[0026] The accompanying drawings in the embodiments of the present invention will clearly and completely describe the technical solutions in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0027] see figure 1 , is a side sectional view of the printed circuit board disclosed in the present invention. The printed circuit board 10 includes an insulating layer 13 and a conductive layer 11 . The insulating layer 13 has two opposite surfaces, and the conductive layer 11 covers at least one of the surfaces of the insulating layer 13 .

[0028] In a preferred embodiment of the present invention, the insulating layer 13 is polyimide film or polyester film. The conductive m...

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Abstract

The invention provides a printed circuit board and a manufacturing method thereof. The printed circuit board comprises an insulating layer and a conductive layer. The manufacturing method of the printed circuit board comprises the steps of providing an insulating layer; printing the surface of the insulating layer with conductive metal slurry; and baking the insulating layer in sections, and solidifying the conductive metal slurry to form a conductive layer so as to obtain the printed circuit board. According to the printed circuit board printing and manufacturing method provided by the invention, the process is simplified, the production efficiency is improved, and the discharge of waste liquid is avoided at the same time, thereby being friendly to the environment.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a printed circuit board and a manufacturing method thereof. Background technique [0002] With the development of modern electronic technology, electronic products play a more important role in people's lives, and people's demand for electronic products is also increasing. All kinds of electronic products require printed circuit boards to realize the layout and layout of various electronic parts. logical connection. [0003] The manufacturing methods of printed circuit boards in the prior art usually adopt methods such as copper foil laminate, cutting, printing solder mask, developing, etching, drilling, and aperture processing to make printed circuit boards. [0004] However, the prior art has the following problems: [0005] First of all, the production of printed circuit boards in the prior art requires multiple steps such as drilling, electroplating, and etching to pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/03H05K1/09H05K3/12
CPCH05K1/02H05K1/032H05K1/034H05K1/09H05K1/092H05K3/1216
Inventor 沈雪芳
Owner 惠州市超频三全周光智能照明科技有限公司