A sensor and its manufacturing method
A manufacturing method and orientation sensor technology, which is applied in semiconductor/solid-state device manufacturing, earthwork drilling, semiconductor devices, etc., can solve problems such as failure of the orientation instrument, large vibration, crosstalk between transmitted signals and received signals, etc., to enhance heat conduction, prevent Effects of warpage and chip fixation
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[0036] The idea of the present invention is to design an orientation-while-drilling sensor that prevents crosstalk and warpage and avoids chip peeling. Examples will be described in the following.
[0037] see figure 1 , the directional sensor while drilling of the present invention, it comprises:
[0038] The heat dissipation substrate 1 has a first surface and a second surface opposite to each other, and as a preference, it can be a ceramic substrate or an insulating substrate with a copper layer on the second surface to improve heat dissipation. A circuit layer (not shown) and a raised partition wall 2 are arranged on the first surface, and the circuit layer is embedded in the heat dissipation substrate 1 and is flush with the first surface; the circuit layer Grooves are realized by laser grooving process and then filled with copper.
[0039] A rubber buffer layer 4 is disposed on the first surface, and the rubber buffer layer 4 is provided with an opening to expose th...
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