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High-stability chemical nickel plating liquid and preparation method thereof

An electroless nickel plating solution with high stability technology, applied in the field of electroless plating, can solve the problems of high difficulty in long-life plating solution research, deposition speed drop, etc., and achieve the effects of low cost, improved porosity, and enhanced stability

Pending Publication Date: 2019-10-11
深圳市宏达秋科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Long-life electroless plating solution will not only save cost, but also be beneficial to environmental protection, but the study of long-life plating solution is more difficult, because the life of plating solution and deposition rate are contradictory, often the life of plating solution is prolonged, and the The deposition rate decreased significantly

Method used

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  • High-stability chemical nickel plating liquid and preparation method thereof
  • High-stability chemical nickel plating liquid and preparation method thereof
  • High-stability chemical nickel plating liquid and preparation method thereof

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Embodiment approach

[0067] As an embodiment, the preparation method of described electroless nickel plating solution, comprises the following steps:

[0068] (1) Adding deionized water with a fraction of 50% of the pre-configured plating solution at room temperature;

[0069] (2) Then add complexing agent, nickel salt, buffering agent and stir until all dissolve under stirring situation,

[0070] (3) Add the remaining ionized water, then add reducing agent, stabilizer and auxiliary agent and stir until they are completely dissolved; then adjust the pH value to 4.1-5.0 with sulfuric acid, and the product is obtained.

[0071] The stirring speed is 500-1500rpm.

[0072] The third aspect of the present invention provides a nickel-plated product prepared by immersing the workpiece to be plated in the nickel-plating solution to form a plated film.

[0073] The workpieces to be plated include but are not limited to: PCB circuit boards, alumina ceramic substrates, aluminum nitride ceramic substrates, ...

Embodiment 1

[0079] A high-stability electroless nickel plating solution, comprising the following components: complexing agent 12g / L, nickel salt 18g / L, reducing agent 30g / L, buffering agent 1g / L, stabilizer 8ppm, auxiliary agent 80ppm .

[0080] The complexing agent is oxalic acid, citric acid, and propionic acid, and the concentration ratio of the oxalic acid, citric acid, and propionic acid is: 1:1:4;

[0081] Described nickel salt is nickel acetate;

[0082] The reducing agent is sodium hypophosphite;

[0083] The buffering agent is sodium acetate and acetic acid, and the concentration ratio of the sodium acetate and acetic acid is 1:1.

[0084] The stabilizer is isothiuride propanesulfonic acid inner salt, and the isothiuride propanesulfonic acid inner salt was purchased from Hubei Youshida Technology Co., Ltd.

[0085] The auxiliary agent is sodium lauryl sulfate.

[0086] The preparation method of described electroless nickel plating solution, comprises the following steps:

...

Embodiment 2

[0092] A high-stability electroless nickel plating solution, comprising the following components: complexing agent 30g / L, nickel salt 30g / L, reducing agent 40g / L, buffering agent 4g / L, stabilizer 18ppm, auxiliary agent 120ppm .

[0093] The complexing agent is oxalic acid, citric acid, and propionic acid, and the concentration ratio of the oxalic acid, citric acid, and propionic acid is: 1:1:4;

[0094] Described nickel salt is nickel acetate;

[0095] The reducing agent is sodium hypophosphite;

[0096] The buffering agent is sodium acetate and acetic acid, and the concentration ratio of the sodium acetate and acetic acid is 1:1.

[0097] The stabilizer is isothiuride propanesulfonic acid inner salt, and the isothiuride propanesulfonic acid inner salt was purchased from Hubei Youshida Technology Co., Ltd.

[0098] The auxiliary agent is sodium lauryl sulfate.

[0099] The preparation method of described electroless nickel plating solution, concrete steps are with embodime...

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Abstract

The invention relates to the field of chemical plating, in particular to high-stability chemical nickel plating liquid and a preparation method thereof. The high-stability chemical nickel plating liquid comprises the following components by concentration: 12-30 g / L of complexing agent, 18-30 g / L of nickel salt, 30-40 g / L of reducing agent, 1-4 g / L of buffer agent, and 8-18 ppm of stabilizing agent, wherein the complexing agent comprises oxalic acid, citric acid and propionic acid. Through a synergistic effect of multiple components, the stability of the plating liquid is improved; the porosityof plating layers is prominently improved; and the plating liquid is simple in process, low in cost and suitable for industrial production.

Description

technical field [0001] The invention relates to the field of chemical plating, in particular to a highly stable chemical nickel plating solution and a preparation method thereof. Background technique [0002] Electroless plating is also called electroless plating, and can also be called autocatalytic plating. The specific process refers to: under certain conditions, the metal ions in the aqueous solution are reduced by the reducing agent and precipitate on the surface of the solid matrix. The basic principle of electroless nickel plating is: under the catalysis of the catalyst, the hypophosphite in the solution catalyzes dehydrogenation on the catalytic surface to form an active hydride, which is oxidized into phosphite; the active hydride and the nickel ions in the solution Reduction reaction is carried out to deposit nickel, which itself is oxidized to hydrogen, and at the same time, part of the hypophosphite in the solution is reduced to elemental phosphorus by hydride a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/36
CPCC23C18/36
Inventor 文明立杨义华陈伟
Owner 深圳市宏达秋科技有限公司
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