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Photosensitive resin composition and cured film comprising same

A technology of photosensitive resin and composition, which is applied in the direction of optics, photomechanical equipment, photoplate process of pattern surface, etc., which can solve the problem of insufficient storage and stability, insufficient adhesion of metal substrates, substrate or electrical wiring characteristics Deterioration and other issues

Active Publication Date: 2019-10-11
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, polyamic acid is easily hydrolyzed by water in the air, etc., and thus preservability and stability are insufficient, polyamic acid has low adhesiveness to applied substrates, etc., and the application thereof The characteristics of substrate or electrical wiring are degraded due to high temperature application
Additionally, other types of photosensitive resins do not have sufficient chemical resistance, heat resistance, or electrical properties in their final cured state, or adequate adhesion to metal substrates, and thus may peel from the substrate during the development or curing process

Method used

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  • Photosensitive resin composition and cured film comprising same
  • Photosensitive resin composition and cured film comprising same
  • Photosensitive resin composition and cured film comprising same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0154] In a 500 mL round bottom flask equipped with a Dean-Stark apparatus and a condenser, 8 g of 4-aminophenol was dissolved in 100 ml of tetrahydrofuran (THF), and 20 ml of trifluoroacetic anhydride was added dropwise thereto at 0°C. After allowing the mixture to react for 2 hours, the solvent was removed and then washed with ethyl acetate and NaHCO 3 Aqueous extraction. The obtained organic layer was precipitated in hexane to obtain substance A.

[0155] Dissolve 4 g of substance A, 1.9 g of 4,4'-diaminodiphenylmethane and 1.4 g of paraformaldehyde in 15 ml of chlorobenzene:xylene (1:1) solution, and allow the mixture to react at 120°C for 3 hours . After the reaction, the mixture was precipitated in hexane and filtered. The obtained solid was dissolved in ethyl acetate and washed with Na 2 CO 3 Aqueous extraction. The solvent of the obtained organic layer was removed to obtain substance B.

[0156] Dissolve 4 g of substance B in 50 ml of ethyl acetate:methanol (100...

Embodiment 2

[0160] Obtain 5g poly(imide-benzo oxazine) block copolymer (PIBZ-2), except that the content of substance C was changed to 3 g and the content of dibutyl 5,5'-oxybis(2-(chlorocarbonyl)benzoate) The content was changed to 4.6 g.

[0161] The molecular weight of the copolymer (PIBZ-2) was measured by GPC in THF solvent, and as a result, the copolymer was determined to have a number average molecular weight (Mn) of 7500 g / mol and a weight average molecular weight (Mw) of 12000 g / mol.

Embodiment 3

[0163] Obtain 5g poly(imide-benzo oxazine) block copolymer (PIBZ-3), except that 4.8 g of 5,5'-(perfluoropropane-2,2-diyl)bis(2-aminobenzene) was used instead of 5 g of 5,5'- (Perfluoropropane-2,2-diyl)bis(2-aminophenol).

[0164] The molecular weight of the copolymer (PIBZ-3) was measured by GPC in THF solvent, and as a result, it was determined that the copolymer had a number average molecular weight (Mn) of 7000 g / mol and a weight average molecular weight (Mw) of 12500 g / mol.

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Abstract

The present invention relates to a photosensitive resin composition containing a poly(imide-benzoxazine) block copolymer, and to a cured film. The poly(imide-benzoxazine) block copolymer contained inthe photosensitive resin composition of the present invention enables the formation of a cured film having excellent mechanical properties and insulating properties even at a low temperature of lowerthan 200 DEG C.

Description

technical field [0001] Cross References to Related Applications [0002] This application claims Korean Patent Application No. 10-2017-0118859 filed with the Korean Intellectual Property Office on September 15, 2017 and Korean Patent Application No. 10-2018-0085443 filed with the Korean Intellectual Property Office on July 23, 2018 rights and interests, the disclosure of which is incorporated herein by reference in its entirety. [0003] The present invention relates to a photosensitive resin composition and a cured film comprising the same. Background technique [0004] Photosensitive resins are representative functional polymer materials commercialized for the production of various precision electronics and information industry products, and are currently being widely used in high-tech industries, especially for the production of semiconductors and displays. [0005] In general, a photosensitive resin is a polymer compound in which a chemical change in molecular structu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/037G03F7/027C09D179/08
CPCG03F7/037C08G73/22C08L79/08G03F7/027C09D179/08C08G73/1085
Inventor 李旼炯崔大胜
Owner LG CHEM LTD