Semiconductor packaging good product detection device
A detection device and semiconductor technology, which is used in measurement devices, semiconductor/solid-state device testing/measurement, analysis of solids using sonic/ultrasonic/infrasonic waves, etc., can solve the problem of poor anti-skid and wear resistance of the product to be inspected, and the convenience of ultrasonic scanning head maintenance. problems such as low sealing and low sealing, to achieve the effect of improving convenience, easy disassembly, and improving anti-skid and wear resistance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0027] see figure 1 , figure 2 , Figure 4 , the present invention provides a technical solution: a semiconductor packaging good product inspection device, including a frame 1 and an ultrasonic scanning body 2 arranged on the frame 1, and a detection seat 3 below, the frame 1, the ultrasonic scanning body 2 1. The detection seat 3 is a relevant accessory on the prior art semiconductor packaging good product detection device. The detection seat 3 is multiple...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


