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Semiconductor packaging good product detection device

A detection device and semiconductor technology, which is used in measurement devices, semiconductor/solid-state device testing/measurement, analysis of solids using sonic/ultrasonic/infrasonic waves, etc., can solve the problem of poor anti-skid and wear resistance of the product to be inspected, and the convenience of ultrasonic scanning head maintenance. problems such as low sealing and low sealing, to achieve the effect of improving convenience, easy disassembly, and improving anti-skid and wear resistance

Inactive Publication Date: 2019-10-15
王欣
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a semiconductor packaging good product inspection device to solve the problem of low airtightness during ultrasonic scanning detection in the prior art, low convenience for the maintenance of the ultrasonic scanning head, and the inspection seat is placed on the product to be inspected. The problem of poor anti-skid and wear resistance

Method used

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  • Semiconductor packaging good product detection device
  • Semiconductor packaging good product detection device
  • Semiconductor packaging good product detection device

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] see figure 1 , figure 2 , Figure 4 , the present invention provides a technical solution: a semiconductor packaging good product inspection device, including a frame 1 and an ultrasonic scanning body 2 arranged on the frame 1, and a detection seat 3 below, the frame 1, the ultrasonic scanning body 2 1. The detection seat 3 is a relevant accessory on the prior art semiconductor packaging good product detection device. The detection seat 3 is multiple...

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Abstract

The invention discloses a semiconductor packaging good product detection device, which comprises a rack, an ultrasonic scanning body arranged on the rack and a detection seat positioned below, whereinthe lower end of the ultrasonic scanning body is provided with an ultrasonic scanning head; two sides, which are connected with the outer wall surface of a round pipe, of the ultrasonic scanning bodyare independently provided with a first cover body and a second cover body; the detection seat is provided with a product to be detected and is provided with a slot; the inner wall surface of the slot is provided with an extrusion cushion; and the bottom end of the first cover body and the bottom end of the second cover body are independently provided with a first insertion board and a second insertion board. Through a sealing cushion arranged on a detachable cover body semicircle groove and an insertion board and slot sealing structure of a V-shaped structure, integral leakproofness is realized, leakproofness during ultrasonic scanning detection is guaranteed, the cover body is integrally convenient in disassembling through a rotatable rectangular clamping block clamping structure, convenience for overhauling the ultrasonic scanning head is improved, and the anti-skidding abrasion performance of the product to be detected on the detection seat is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging inspection, in particular to a semiconductor packaging inspection device. Background technique [0002] A semiconductor refers to a material whose conductivity is between a conductor and an insulator at room temperature. It needs to be inspected for defective products during semiconductor packaging. A semiconductor packaging inspection device for good products is described in the publication number CN208655594U, including a frame and a The belt conveyor at the lower end of the frame, on the belt conveyor, there are a number of items to be inspected arranged in a line along the moving direction of the conveyor belt, and the upper end of the frame is vertically fixed with slide rails, and slide rails are installed up and down inside the slide rails. Ultrasonic scanning detection device for ultrasonic scanning detection of the product to be inspected. The defective and good products i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N29/04G01N29/22H01L21/66
CPCG01N29/04G01N29/22G01N29/223G01N2291/2697H01L22/12
Inventor 王欣
Owner 王欣