Highly-hydrophobic colorless transparent and heat-resisting polyimide film and preparation method thereof

Abstract

The invention discloses a highly-hydrophobic colorless transparent and heat-resisting polyimide film and a preparation method thereof. The preparation method comprises the steps that firstly, two diamine monomers, namely, 2-(4-aminophenyl)-5-aminobenzimidazole and a X monomer with a certain proportion, and a dianhydride monomer containing 4,4'-(hexafluoroisopropylidene)diphthalic anhydride are subjected to solution polymerization to generate a polyamide acid copolymer, the polyamide acid copolymer is casted on a glass plate to form a film, desolventizing is conducted at the high temperature, imidization is conducted, and thus the highly-hydrophobic colorless transparent and heat-resisting polyimide film can be obtained. The preparation method is easy to operate, large-scale application andpromotion are easy, and the prepared polyimide film is colorless and transparent, further has excellent heat resistance and hydrophobicity, and can be better applied to a flexible display device.

Description

technical field [0001] The invention relates to a polyimide material and a preparation method thereof, in particular to a high hydrophobicity transparent heat-resistant polyimide material and a preparation method, belonging to the technical field of polymer materials. Background technique [0002] In recent years, flexible electronics and flexible display technology have developed rapidly in the field of electronic information, and the development of flexible electronic products with lightweight, bendable, foldable and even rollable characteristics has become the goal of the flexible display industry. The flexible substrate is an important part of the entire flexible display device, and its performance has an important impact on the quality and life of the flexible display device. Polyimide has become the preferred material for flexible display device substrates due to its outstanding heat resistance, chemical stability, excellent mechanical properties, and good dielectric p...

AI Technical Summary

Problems solved by technology

Chinese patent application 201711413756.9 introduces fluorine-containing groups and pyridine rings into the main chain of polyimide through molecular design to improve the dissolution resistance of the polymer and maintain its mechanical properties and thermal stability, and obtain a new type of thermosetting fluorine-containing polyimide imine polymer with a glass transition temperature of 346°C, T 5% The thermal weight loss temperature is 575°C, T 10% The thermal weight loss temperature is 602°C, and the contact angle is lower than 95°. Although the heat resistance is excellent, the hydrophobicity is not excellent enough

Chinese patent application 201710574815.4 synthesized a highly transparent and low dielectric polyimide film by fluorinated dianhydride 6FDA and fluorinated diamine TFDB, with a maximum light transmittance of over 91%, a dielectric constant of less than 3, and high tensile strength At 150MPa, the contact angle is between 72 and 74°. Although high transparency and low dielectric properties have been achieved, the hydrophobic performance needs to be improved

[0007] In the field of flexible display, polyimide imide materials are required to have better transparency, higher heat resistance and hydrophobicity. It is difficult for transparent polyimides on the market to have these characteristics.